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Patent
D927429
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Priority
Mar 15 2019
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Filed
Mar 15 2019
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Issued
Aug 10 2021
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Expiry
Aug 10 2036
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Assg.orig
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Entity
unknown
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4
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13
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n/a
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The ornamental design for a plurality of contact fields for a printed circuit board, as shown and described.
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FIG. 1 is a top perspective view of a plurality of contact fields for a printed circuit board, showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a right elevation view thereof;
FIG. 6 is a left elevation view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a bottom perspective view of thereof, shown enlarged; and,
FIG. 10 is a bottom elevation thereof, shown enlarged.
The equal-length broken lines depict environmental subject matter that forms no part of the claimed design.
Adams, Lynwood, Lewis, Jack
Patent |
Priority |
Assignee |
Title |
10368435, |
Jun 05 2015 |
|
Systems and methods for breadboard style printed circuit board |
4330684, |
Dec 27 1977 |
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Matrix board |
4498122, |
Dec 29 1982 |
AT&T Bell Laboratories |
High-speed, high pin-out LSI chip package |
5049084, |
Dec 05 1989 |
Circuit Components, Incorporated |
Electrical circuit board interconnect |
5199907, |
Jun 18 1992 |
AMP Incorporated |
Electrical connector having contacts with board retention feature |
7378600, |
Mar 14 2005 |
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Electronic circuit prototyping composite support |
20040205402, |
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|
D319629, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semiconductor substrate with conducting pattern |
D334175, |
Apr 12 1991 |
K & S INTERCONNECT, INC |
Probe interface test board |
D457146, |
Nov 29 2000 |
Kabushiki Kaisha Kaisha Toshiba |
Substrate for a semiconductor element |
D821338, |
Jan 20 2015 |
MODUS TEST, LLC |
Contact fields for a printed circuit board |
D872032, |
Sep 14 2018 |
TELIT COMMUNICATIONS S P A |
Connection module |
D875057, |
May 26 2017 |
TINY PCB, Inc. |
Modular circuit board |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a