Patent
   D901405
Priority
Mar 28 2017
Filed
Sep 27 2017
Issued
Nov 10 2020
Expiry
Nov 10 2035
Assg.orig
Entity
unknown
5
47
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a rear perspective view of a semiconductor device showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a right side view thereof, the left side view thereof being a mirror image.

The dot-dash broken lines represent the bounds of the claimed design, while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design. In addition, the unshaded surfaces in the FIG. 6 view between the solid line edge and the broken lines forms no part of the claimed design.

Takahashi, Keiichi, Saito, Koshun

Patent Priority Assignee Title
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D974311, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
D975666, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 31 2017SAITO, KOSHUNROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0441000582 pdf
Sep 05 2017TAKAHASHI, KEIICHIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0441000582 pdf
Sep 27 2017Rohm Co., Ltd.(assignment on the face of the patent)
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