Patent
   D853343
Priority
Oct 19 2017
Filed
Apr 17 2018
Issued
Jul 09 2019
Expiry
Jul 09 2034
Assg.orig
Entity
unknown
5
50
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a perspective view of a semiconductor device showing my new design;

FIG. 2 is a front view thereof, the rear view being a mirror image of FIG. 2;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a left side view thereof.

The broken lines illustrate portions of the semiconductor device and form no part of the claimed design.

Nii, Akinori

Patent Priority Assignee Title
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D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
D974311, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
D975666, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 03 2018NII, AKINORIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0459670501 pdf
Apr 17 2018Rohm Co., Ltd.(assignment on the face of the patent)
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