Patent
   D396211
Priority
Sep 09 1996
Filed
Mar 03 1997
Issued
Jul 21 1998
Expiry
Jul 21 2012
Assg.orig
Entity
unknown
16
10
n/a
The ornamental design for an integrated circuit device, as shown.

FIG. 1 is a perspective view of the top, front and left side of an integrated circuit device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a front elevational view thereof; and,

FIG. 7 is a rear elevational view thereof.

Kajiwara, Satomi, Enomoto, Yoshinari

Patent Priority Assignee Title
D427977, Jun 18 1999 FUKIJURA LTD Piezoelectric conversion type semiconductor device
D428859, Jan 28 1999 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864135, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D888673, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D903613, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D913978, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D920265, Sep 29 2019 CHINA CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D920266, Sep 29 2019 CHINA CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D934187, Jan 21 2020 GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
D978809, Apr 13 2018 Rohm Co., Ltd. Semiconductor module
ER1981,
ER2039,
Patent Priority Assignee Title
4868349, May 09 1988 National Semiconductor Corporation Plastic molded pin-grid-array power package
5220298, Jul 24 1990 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
5221859, Feb 26 1990 Hitachi, Ltd. Lead frame for semiconductor device
5585670, Sep 05 1995 Mitsubishi Electric Semiconductor Software Co.; Mitsubishi Denki Kabushiki Kaisha Semiconductor device package
D317592, Jan 19 1987 Canon Kabushiki Kaisha Semiconductor element
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D358806, Sep 24 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D362258, Jul 23 1993 Fuji Electric Co., Ltd. Distance measuring unit for an automatic focusing camera
D362259, Jul 23 1993 Fuji Electric Co., Ltd. Distance measuring unit for an automatic focusing camera
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 10 1997ENOMOTO, YOSHINARIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0084960900 pdf
Feb 10 1997KAJIWARA, SATOMIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0084960900 pdf
Mar 03 1997Fuji Electric Co., Ltd.(assignment on the face of the patent)
Apr 01 2011FUJI ELECTRIC SYSTEMS CO , LTD FES FUJI ELECTRIC CO , LTD MERGER AND CHANGE OF NAME0269700872 pdf
Apr 01 2011FUJI TECHNOSURVEY CO , LTD MERGER BY ABSORPTION FUJI ELECTRIC CO , LTD MERGER AND CHANGE OF NAME0269700872 pdf
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