FIG. 1 is a front elevational view of a semiconductor element showing my
new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and
FIG. 5 is a left side elevational view thereof, the right side elevational
view being the same.
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Assignee |
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SGS-Thomson Microelectronics, Inc. |
Surface mountable integrated circuit package with detachable module |
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Aug 31 1993 |
SGS-Thomson Microelectronics, Inc.; SGS THOMSON MICROELECTRONICS, INC |
Surface mountable integrated circuit package with low-profile detachable module |
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Sep 24 1993 |
SGS-Thomson Microelectronics, Inc |
Socketed integrated circuit package |
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Sep 02 1993 |
SGS-Thomson Microelectronics, Inc |
Socketed integrated circuit package |
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Apr 25 1997 |
Micron Technology, Inc. |
Temporary package for semiconductor dice |
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Sep 09 1996 |
FUJI ELECTRIC CO , LTD |
Integrated circuit device |
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Sep 09 1996 |
FUJI ELECTRIC CO , LTD |
Integrated circuit device |
D396213, |
Sep 09 1996 |
FUJI ELECTRIC CO , LTD |
Integrated circuit device |
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Dec 24 1996 |
FUJI ELECTRIC CO , LTD |
Hybrid integrated circuit for electric power control |
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Dec 26 1996 |
Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. |
Connector for printed circuit boards |
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Apr 01 1997 |
Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. |
Connector for printed circuit boards |
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Apr 25 1997 |
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Temporary package for semiconductor dice |
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Dec 11 1996 |
Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. |
Connector for printed circuit boards |
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Dec 11 1996 |
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Nov 06 1997 |
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Single component computer |
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Sep 29 1998 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
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Apr 24 1998 |
Sony Corporation |
Semiconductor element |
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Aug 06 1997 |
Sony Corporation |
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Sep 29 1998 |
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Jun 18 1999 |
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Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
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Aug 06 1997 |
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Semiconductor element |
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Mar 06 2001 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor package |
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May 23 2001 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package |
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Oct 11 2005 |
GEM SERVICES, INC |
Quad-28JW surface mount package |
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Oct 11 2005 |
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May 08 2013 |
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Semiconductor device |
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Semiconductor device |
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Semiconductor module |
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Jun 12 2018 |
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Packaged semiconductor module |
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Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
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Mar 15 2019 |
TAMURA CORPORATION |
Semiconductor element |
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May 14 2019 |
Rohm Co., Ltd. |
Packaged semiconductor module |
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Nov 27 2019 |
The Noco Company |
Semiconductor device |
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Nov 27 2019 |
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Semiconductor device |
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Apr 06 2020 |
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Power semiconductor package |
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Apr 13 2018 |
Rohm Co., Ltd. |
Semiconductor module |
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ER2039, |
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