Patent
   D317592
Priority
Jan 19 1987
Filed
Jul 02 1987
Issued
Jun 18 1991
Expiry
Jun 18 2005
Assg.orig
Entity
unknown
40
8
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a front elevational view of a semiconductor element showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof; and

FIG. 5 is a left side elevational view thereof, the right side elevational view being the same.

Yoshizawa, Tetsuo

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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 22 1987YOSHIZAWA, TETSUOCanon Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST 0047410015 pdf
Jul 02 1987Canon Kabushiki Kaisha(assignment on the face of the patent)
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