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Patent
D560623
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Priority
Oct 11 2005
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Filed
Oct 11 2005
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Issued
Jan 29 2008
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Expiry
Jan 29 2022
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Assg.orig
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Entity
unknown
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1
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15
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n/a
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The ornamental design for quad-24JW surface mount package, as shown and described.
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FIG. 1 is a perspective view of a quad-24JW surface mount package showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.
Harnden, James, Chia, Anthony, Yang, Hongbo, Wong, Liming
Patent |
Priority |
Assignee |
Title |
5742169, |
Feb 20 1996 |
Micron Technology, Inc. |
Apparatus for testing interconnects for semiconductor dice |
5949241, |
Feb 20 1996 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Method for testing interconnects and semiconductor dice |
6222379, |
Jun 04 1991 |
Micron Technology, Inc. |
Conventionally sized temporary package for testing semiconductor dice |
7057273, |
May 15 2001 |
GEM SERVICES, INC |
Surface mount package |
D317592, |
Jan 19 1987 |
Canon Kabushiki Kaisha |
Semiconductor element |
D402638, |
Apr 25 1997 |
Micron Technology, Inc. |
Temporary package for semiconductor dice |
D428859, |
Jan 28 1999 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D441727, |
Oct 04 2000 |
Sony Corporation |
Semiconductor element |
D461170, |
May 15 2001 |
GEM SERVICES, INC |
Surface mount package |
D461172, |
Jul 17 2001 |
GEM SERVICES, INC |
Surface mount package |
D462062, |
May 18 2001 |
GSLE Development Corporation; SPX Corporation |
Surface mount package |
D467231, |
Jul 17 2001 |
GEM SERVICES, INC |
Surface mount package |
D467560, |
Jul 17 2001 |
GEM SERVICES, INC |
Surface mount package |
D467884, |
May 15 2001 |
GEM SERVICES, INC |
Surface mount package |
D467885, |
Jul 18 2001 |
GEM SERVICES, INC |
Surface mount package |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a