Patent
   D560623
Priority
Oct 11 2005
Filed
Oct 11 2005
Issued
Jan 29 2008
Expiry
Jan 29 2022
Assg.orig
Entity
unknown
1
15
n/a
The ornamental design for quad-24JW surface mount package, as shown and described.

FIG. 1 is a perspective view of a quad-24JW surface mount package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

Harnden, James, Chia, Anthony, Yang, Hongbo, Wong, Liming

Patent Priority Assignee Title
D675582, Jun 27 2011 UI TECHNOLOGIES, INC Chip assembly
Patent Priority Assignee Title
5742169, Feb 20 1996 Micron Technology, Inc. Apparatus for testing interconnects for semiconductor dice
5949241, Feb 20 1996 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Method for testing interconnects and semiconductor dice
6222379, Jun 04 1991 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
7057273, May 15 2001 GEM SERVICES, INC Surface mount package
D317592, Jan 19 1987 Canon Kabushiki Kaisha Semiconductor element
D402638, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
D428859, Jan 28 1999 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D441727, Oct 04 2000 Sony Corporation Semiconductor element
D461170, May 15 2001 GEM SERVICES, INC Surface mount package
D461172, Jul 17 2001 GEM SERVICES, INC Surface mount package
D462062, May 18 2001 GSLE Development Corporation; SPX Corporation Surface mount package
D467231, Jul 17 2001 GEM SERVICES, INC Surface mount package
D467560, Jul 17 2001 GEM SERVICES, INC Surface mount package
D467884, May 15 2001 GEM SERVICES, INC Surface mount package
D467885, Jul 18 2001 GEM SERVICES, INC Surface mount package
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 11 2005GEM Services, Inc.(assignment on the face of the patent)
Nov 21 2005HARDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174360066 pdf
Nov 29 2005CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174360066 pdf
Nov 29 2005WONG, LIMINGGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174360066 pdf
Nov 29 2005YANG, HONGBOGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174360066 pdf
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