Patent
   D461170
Priority
May 15 2001
Filed
May 15 2001
Issued
Aug 06 2002
Expiry
Aug 06 2016
Assg.orig
Entity
unknown
5
10
n/a
The ornamental design for a surface mount package, as shown and described.

FIG. 1 is a perspective view of a surface mount package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 the right side elevational view thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Williams, Richard, Harnden, James, Chia, Anthony, Weibing, Chu

Patent Priority Assignee Title
D505122, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D513608, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D558694, Oct 11 2005 GEM SERVICES, INC Quad-28JW surface mount package
D560623, Oct 11 2005 GEM SERVICES, INC Quad-24JW surface mount package
D729182, Apr 24 2014 CURRENT WAYS, INC Integrated board mount device
Patent Priority Assignee Title
4984062, Mar 30 1987 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device
5224021, Oct 20 1989 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Surface-mount network device
5446623, Aug 24 1993 Rohm Co. Ltd. Surface mounting type polar electronic component
5625226, Sep 19 1994 International Rectifier Corporation Surface mount package with improved heat transfer
6040626, Sep 25 1998 Infineon Technologies Americas Corp Semiconductor package
6211462, Nov 05 1998 Texas Instruments Incorporated Low inductance power package for integrated circuits
6242797, May 19 1997 Renesas Electronics Corporation Semiconductor device having pellet mounted on radiating plate thereof
6242800, Mar 12 1997 INTELLECTUAL DISCOVERY CO , LTD Heat dissipating device package
6249041, Jun 02 1998 Siliconix Incorporated IC chip package with directly connected leads
D402638, Apr 25 1997 Micron Technology, Inc. Temporary package for semiconductor dice
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 15 2001GEM Services, Inc.(assignment on the face of the patent)
Jun 18 2001CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124610173 pdf
Jun 18 2001WEIBING, CHUGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124610173 pdf
Sep 24 2001HARNDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124610173 pdf
Oct 12 2001WILLIAMS, RICHARDGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124610173 pdf
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