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Patent
   D513608
Priority
Jan 03 2003
Filed
Jan 03 2003
Issued
Jan 17 2006
Expiry
Jan 17 2020
Inventors
Williams, …
Assg.orig
GEM Servic…
Assg.curr
GEM SERVIC…
Entity
unknown
Referenced by
5
References
38
Maint.:
n/a
The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.
INVENTORS:

Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu, Lam, Allen K.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
8853837, Dec 13 2007 LITE-ON ELECTRONICS GUANGZHOU LIMITED; LITE-ON TECHNOLOGY CORP Optoisolator leadframe assembly
D585847, Sep 08 2006 CREE LED, INC LED lighting tile
D588080, Sep 26 2007 GEM SERVICES, INC 2021-8J matrix leadframe
D588557, Oct 02 2007 GEM SERVICES, INC 4040-28J matrix leadframe
D803799, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
3698074,
4118859, Dec 01 1976 AMP Incorporated Packaging and assembly of sheet metal parts
4234666, Jul 26 1978 AT & T TECHNOLOGIES, INC , Carrier tapes for semiconductor devices
4298883, Apr 26 1977 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
4633582, Aug 14 1985 QT OPTOELECTRONICS Method for assembling an optoisolator and leadframe therefor
4809054, Jul 25 1986 Semiconductor lead frame
4818960, Apr 06 1987 TDK Corporation Composite part and method of manufacturing same
4852250, Jan 19 1988 Stovokor Technology LLC Hermetically sealed package having an electronic component and method of making
4865193, Jun 23 1987 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
5115299, Jul 13 1989 GTE Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
5554886, Mar 30 1994 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
5900582, Jun 05 1992 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
6016918, Aug 18 1998 DIAL TOOL INDUSTRIES, INC , AN ILLINOIS CORPORATION Part carrier strip
6170151, Mar 04 1997 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
6265761, May 07 1999 Maxim Integrated Products, Inc.; Maxim Integrated Products, Inc Semiconductor devices with improved lead frame structures
6329710, Sep 13 1996 Micron Technology, Inc. Integrated circuit package electrical enhancement
6389672, May 10 1996 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
6486538, May 27 1999 Polaris Innovations Limited Chip carrier having ventilation channels
6543512, Oct 28 1998 Micron Technology, Inc. Carrier, method and system for handling semiconductor components
6566740, Mar 23 2000 Mitsui High-Tec INC Lead frame for a semiconductor device and method of manufacturing a semiconductor device
D461170, May 15 2001 GEM SERVICES, INC Surface mount package
D461172, Jul 17 2001 GEM SERVICES, INC Surface mount package
D461459, Jul 17 2001 GEM SERVICES, INC Surface mount package
D461783, Jun 08 2001 GEM SERVICES, INC Surface mount package
D461784, Jul 17 2001 GEM SERVICES, INC Surface mount package
D462062, May 18 2001 GSLE Development Corporation; SPX Corporation Surface mount package
D465207, Jun 08 2001 GEM SERVICES, INC Leadframe matrix for a surface mount package
D467231, Jul 17 2001 GEM SERVICES, INC Surface mount package
D467560, Jul 17 2001 GEM SERVICES, INC Surface mount package
D467884, May 15 2001 GEM SERVICES, INC Surface mount package
D467885, Jul 18 2001 GEM SERVICES, INC Surface mount package
D471165, May 15 2001 GEM SERVICES, INC Surface mount package
D483336, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D483337, Nov 25 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484103, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484104, Nov 25 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484858, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484859, Feb 07 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 03 2003GEM Services, Inc.(assignment on the face of the patent)
Jan 30 2003WILLIAMS, RICHARD K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610426 pdf
Jan 30 2003LAM, ALLEN K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610426 pdf
Feb 13 2003CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610426 pdf
Feb 13 2003WEIBING, CHUGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610426 pdf
Mar 06 2003HARNDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610426 pdf
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