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Patent
   D484103
Priority
Nov 15 2002
Filed
Nov 15 2002
Issued
Dec 23 2003
Expiry
Dec 23 2017

TERM.DISCL.
Inventors
Williams, …
Assg.orig
GEM Servic…
Assg.curr
GEM SERVIC…
Entity
unknown
Referenced by
7
References
13
Maint.:
n/a
The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.
INVENTORS:

Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D505121, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D505122, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D513608, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D588080, Sep 26 2007 GEM SERVICES, INC 2021-8J matrix leadframe
D588557, Oct 02 2007 GEM SERVICES, INC 4040-28J matrix leadframe
D761216, Dec 12 2014 JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD LED leadframe
D803799, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
4118859, Dec 01 1976 AMP Incorporated Packaging and assembly of sheet metal parts
4234666, Jul 26 1978 AT & T TECHNOLOGIES, INC , Carrier tapes for semiconductor devices
4298883, Apr 26 1977 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
4633582, Aug 14 1985 QT OPTOELECTRONICS Method for assembling an optoisolator and leadframe therefor
4809054, Jul 25 1986 Semiconductor lead frame
4818960, Apr 06 1987 TDK Corporation Composite part and method of manufacturing same
4852250, Jan 19 1988 Stovokor Technology LLC Hermetically sealed package having an electronic component and method of making
4865193, Jun 23 1987 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
5115299, Jul 13 1989 GTE Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
5554886, Mar 30 1994 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
5900582, Jun 05 1992 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
6016918, Aug 18 1998 DIAL TOOL INDUSTRIES, INC , AN ILLINOIS CORPORATION Part carrier strip
D465207, Jun 08 2001 GEM SERVICES, INC Leadframe matrix for a surface mount package
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 15 2002GEM Services, Inc.(assignment on the face of the patent)
Jan 20 2003HARNDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0134460712 pdf
Jan 20 2003WILLIAMS, RICHARD K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0134460712 pdf
Jan 27 2003CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0134460712 pdf
Jan 27 2003WEIBING, CHUGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0134460712 pdf
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
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