2021-8J matrix leadframe

2021-8J matrix leadframe
D588080

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Patent D588080
Priority Sep 26 2007
Filed Sep 26 2007
Issued Mar 10 2009
Expiry Mar 10 2023
Inventors Harnden, J…
Assg.orig GEM Servic…
Assg.curr GEM SERVIC…
Entity unknown
Referenced by 14
References 25
Maint.: n/a

The ornamental design for 2021-8J matrix leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 2021-8J matrix leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the 2021-8J matrix leadframe shown in FIG. 1 for ease of illustration; and,

FIG. 3 is a perspective view of FIG. 1.

INVENTORS:

Harnden, James, Chia, Anthony, Yang, Hongbo, Hui, Teng

THIS PATENT IS REFERENCED BY THESE PATENTS:

Patent	Priority	Assignee	Title
10438816,	May 02 2012	Texas Instruments Incorporated	Selective planishing method for making a semiconductor device
8587099,	May 02 2012	Texas Instruments Incorporated	Leadframe having selective planishing
8649820,	Nov 07 2011	BlackBerry Limited	Universal integrated circuit card apparatus and related methods
8936199,	Apr 13 2012	BlackBerry Limited	UICC apparatus and related methods
8963300,	May 02 2012	TEXAS INSTRUMENTS INCORPORATION	Semiconductor device with selective planished leadframe
9006038,	May 02 2012	Texas Instruments Incorporated	Selective leadframe planishing
9972506,	May 02 2012	Texas Instruments Incorporated	Selective planishing method for making a semiconductor device
D701864,	Apr 23 2012	BlackBerry Limited	UICC apparatus
D702240,	Apr 13 2012	Malikie Innovations Limited	UICC apparatus
D703208,	Apr 13 2012	Malikie Innovations Limited	UICC apparatus
D761216,	Dec 12 2014	JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD	LED leadframe
D803799,	Apr 20 2015	Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation	Lead frame
D803800,	Apr 20 2015	Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation	Lead frame
D803801,	Apr 20 2015	Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation	Lead frame

THIS PATENT REFERENCES THESE PATENTS:

Patent	Priority	Assignee	Title
4846700,	Apr 06 1987	DIE TECH, INC	Lead frame for semi-conductor device
4870474,	Dec 12 1986	Texas Instruments Incorporated	Lead frame
5486722,	May 11 1993	Sumitomo Metal MIning Company, Limited	Lead frame having small pitch between outer leads
6566740,	Mar 23 2000	Mitsui High-Tec INC	Lead frame for a semiconductor device and method of manufacturing a semiconductor device
6885086,	Mar 05 2002	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD	Reduced copper lead frame for saw-singulated chip package
D298231,	Apr 24 1985	Sumitomo Electric Industries, Ltd.	Lead frame for a semiconductor element or the like
D483336,	Nov 15 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D483337,	Nov 25 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D484103,	Nov 15 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D484104,	Nov 25 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D484858,	Nov 15 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D484859,	Feb 07 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D485243,	Oct 22 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D485244,	Dec 17 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D485808,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D486802,	Dec 17 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D487431,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D487432,	Feb 07 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D488136,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D491900,	Dec 17 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D492266,	Nov 15 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D494939,	Dec 17 2002	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D505121,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D505122,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D513608,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe

ASSIGNMENT RECORDS Assignment records on the USPTO

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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Sep 26 2007		GEM Services, Inc.	(assignment on the face of the patent)
Nov 02 2007	CHIA, ANTHONY	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	020301	0338	pdf
Nov 02 2007	YANG, HONGBO	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	020301	0338	pdf
Nov 02 2007	TENG, HUI	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	020301	0338	pdf
Nov 12 2007	HAMDEN, JAMES	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	020301	0338	pdf

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