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Patent
D487432
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Priority
Feb 07 2003
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Filed
Feb 07 2003
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Issued
Mar 09 2004
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Expiry
Mar 09 2018
TERM.DISCL.
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Assg.orig
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Entity
unknown
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8
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13
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n/a
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The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.
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FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of surface mount package leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a matrix incorparating a plurality of surface mount package leadframes showing my new design.
Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu
Patent |
Priority |
Assignee |
Title |
D505121, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D505122, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D588080, |
Sep 26 2007 |
GEM SERVICES, INC |
2021-8J matrix leadframe |
D588557, |
Oct 02 2007 |
GEM SERVICES, INC |
4040-28J matrix leadframe |
D761216, |
Dec 12 2014 |
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD |
LED leadframe |
D803799, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
D803800, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
D803801, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
Patent |
Priority |
Assignee |
Title |
4118859, |
Dec 01 1976 |
AMP Incorporated |
Packaging and assembly of sheet metal parts |
4234666, |
Jul 26 1978 |
AT & T TECHNOLOGIES, INC , |
Carrier tapes for semiconductor devices |
4298883, |
Apr 26 1977 |
Tokyo Shibaura Electric Co., Ltd. |
Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet |
4633582, |
Aug 14 1985 |
QT OPTOELECTRONICS |
Method for assembling an optoisolator and leadframe therefor |
4809054, |
Jul 25 1986 |
|
Semiconductor lead frame |
4818960, |
Apr 06 1987 |
TDK Corporation |
Composite part and method of manufacturing same |
4852250, |
Jan 19 1988 |
Stovokor Technology LLC |
Hermetically sealed package having an electronic component and method of making |
4865193, |
Jun 23 1987 |
Mitsubishi Denki Kabushiki Kaisha |
Tape carrier for tape automated bonding process and a method of producing the same |
5115299, |
Jul 13 1989 |
GTE Products Corporation |
Hermetically sealed chip carrier with ultra violet transparent cover |
5554886, |
Mar 30 1994 |
Goldstar Electron Co., Ltd. |
Lead frame and semiconductor package with such lead frame |
5900582, |
Jun 05 1992 |
Mitsubishi Denki Kabushiki Kaisha |
Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame |
6016918, |
Aug 18 1998 |
DIAL TOOL INDUSTRIES, INC , AN ILLINOIS CORPORATION |
Part carrier strip |
D465207, |
Jun 08 2001 |
GEM SERVICES, INC |
Leadframe matrix for a surface mount package |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a