Patent
   D803801
Priority
Apr 20 2015
Filed
Oct 20 2015
Issued
Nov 28 2017
Expiry
Nov 28 2032
Assg.orig
Entity
unknown
2
40
n/a
The ornamental design for a lead frame, as shown and described.

FIG. 1 is an enlarged fragmented perspective view taken along line 2 in FIG. 11 of a lead frame, showing my new design;

FIG. 2 is an enlarged fragmented view thereof taken along line 2 in FIG. 11;

FIG. 3 is an end view thereof taken along line 3-3 in FIG. 2;

FIG. 4 is an end view thereof taken along line 4-4 in FIG. 2;

FIG. 5 is an end view thereof taken along line 5-5 in FIG. 2;

FIG. 6 is an end view thereof taken along line 6-6 in FIG. 2;

FIG. 7 is an end view thereof taken along line 7-7 in FIG. 2;

FIG. 8 is an end view thereof taken along line 8-8 in FIG. 2;

FIG. 9 is an end view thereof taken along line 9-9 in FIG. 2;

FIG. 10 is a perspective view thereof;

FIG. 11 is a front view thereof;

FIG. 12 is a top view thereof;

FIG. 13 is a bottom view thereof;

FIG. 14 is a right side view thereof, the opposite side being symmetrical;

FIG. 15 is a rear view thereof;

FIG. 16 is an enlarged view thereof taken along line 16-16 in FIG. 13;

FIG. 17 is an end view thereof taken along line 17-17 in FIG. 11; and,

FIG. 18 is an end view thereof taken along line 18-18 in FIG. 11.

The Dash-Dot broken lines in FIG. 11 labeled as “2” are included to indicate the point at which the magnified view is cut off. The Dash-Dot broken lines define the bounds of the claimed design and form no part thereof. The Dash-Dash broken line portion of the figure drawings is included to show environment and form no part of the claimed design.

Takeshita, Atsushi

Patent Priority Assignee Title
10964628, Feb 21 2019 Infineon Technologies AG Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
11515244, Feb 21 2019 Infineon Technologies AG Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
Patent Priority Assignee Title
6316821, Sep 28 1998 MONTEREY RESEARCH, LLC High density lead frames and methods for plastic injection molding
6409775, Feb 09 1999 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
6433424, Dec 14 2000 Infineon Technologies Americas Corp Semiconductor device package and lead frame with die overhanging lead frame pad
9054091, Jun 10 2013 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
9607934, Jul 31 2013 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
20100052125,
20110212341,
20140252574,
20140327004,
20150064849,
20160027721,
20160218051,
D483336, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484104, Nov 25 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484858, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484859, Feb 07 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D485244, Dec 17 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D485808, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D487431, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D487432, Feb 07 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D488136, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D491900, Dec 17 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D492266, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D494939, Dec 17 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D505121, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D505122, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D588080, Sep 26 2007 GEM SERVICES, INC 2021-8J matrix leadframe
D637566, Aug 10 2010 Hubbell Incorporated Electrical receptacle circuit board
D656469, Apr 28 2011 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
D762197, Sep 12 2014 Taoglas Group Holdings Limited GPS antenna assembly
JP1038773,
JP1104548,
JP1335983,
JP1444894,
JP1445011,
JP1445012,
JP1460669,
JP2013128007,
JP300329688,
JP30032968801,
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 06 2015TAKESHITA, ATSUSHIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0368370352 pdf
Oct 20 2015Kabushiki Kaisha Toshiba(assignment on the face of the patent)
Apr 10 2018Kabushiki Kaisha ToshibaToshiba Electronic Devices & Storage CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0456660615 pdf
Apr 17 2018Toshiba Electronic Devices & Storage CorporationKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0456660626 pdf
Apr 17 2018Toshiba Electronic Devices & Storage CorporationToshiba Electronic Devices & Storage CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0456660626 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule