FIG. 1 is an enlarged fragmented perspective view taken along line 2 in FIG. 11 of a lead frame, showing my new design;
FIG. 2 is an enlarged fragmented view thereof taken along line 2 in FIG. 11;
FIG. 3 is an end view thereof taken along line 3-3 in FIG. 2;
FIG. 4 is an end view thereof taken along line 4-4 in FIG. 2;
FIG. 5 is an end view thereof taken along line 5-5 in FIG. 2;
FIG. 6 is an end view thereof taken along line 6-6 in FIG. 2;
FIG. 7 is an end view thereof taken along line 7-7 in FIG. 2;
FIG. 8 is an end view thereof taken along line 8-8 in FIG. 2;
FIG. 9 is an end view thereof taken along line 9-9 in FIG. 2;
FIG. 10 is a perspective view thereof;
FIG. 11 is a front view thereof;
FIG. 12 is a top view thereof;
FIG. 13 is a bottom view thereof;
FIG. 14 is a right side view thereof, the opposite side being symmetrical;
FIG. 15 is a rear view thereof;
FIG. 16 is an enlarged view thereof taken along line 16-16 in FIG. 13;
FIG. 17 is an end view thereof taken along line 17-17 in FIG. 11; and,
FIG. 18 is an end view thereof taken along line 18-18 in FIG. 11.
The Dash-Dot broken lines in FIG. 11 labeled as “2” are included to indicate the point at which the magnified view is cut off. The Dash-Dot broken lines define the bounds of the claimed design and form no part thereof. The Dash-Dash broken line portion of the figure drawings is included to show environment and form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
6316821, |
Sep 28 1998 |
MONTEREY RESEARCH, LLC |
High density lead frames and methods for plastic injection molding |
6409775, |
Feb 09 1999 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
6433424, |
Dec 14 2000 |
Infineon Technologies Americas Corp |
Semiconductor device package and lead frame with die overhanging lead frame pad |
9054091, |
Jun 10 2013 |
Alpha & Omega Semiconductor, Inc. |
Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures |
9607934, |
Jul 31 2013 |
Nichia Corporation |
Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
20100052125, |
|
|
|
20110212341, |
|
|
|
20140252574, |
|
|
|
20140327004, |
|
|
|
20150064849, |
|
|
|
20160027721, |
|
|
|
20160218051, |
|
|
|
D483336, |
Nov 15 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D484104, |
Nov 25 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D484858, |
Nov 15 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D484859, |
Feb 07 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D485244, |
Dec 17 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D485808, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D487431, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D487432, |
Feb 07 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D488136, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D491900, |
Dec 17 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D492266, |
Nov 15 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D494939, |
Dec 17 2002 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D505121, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D505122, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D588080, |
Sep 26 2007 |
GEM SERVICES, INC |
2021-8J matrix leadframe |
D637566, |
Aug 10 2010 |
Hubbell Incorporated |
Electrical receptacle circuit board |
D656469, |
Apr 28 2011 |
Kabushiki Kaisha Toshiba |
Portion of a light-emitting diode |
D762197, |
Sep 12 2014 |
Taoglas Group Holdings Limited |
GPS antenna assembly |
JP1038773, |
|
|
|
JP1104548, |
|
|
|
JP1335983, |
|
|
|
JP1444894, |
|
|
|
JP1445011, |
|
|
|
JP1445012, |
|
|
|
JP1460669, |
|
|
|
JP2013128007, |
|
|
|
JP300329688, |
|
|
|
JP30032968801, |
|
|
|