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Patent
D488136
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Priority
Jan 03 2003
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Filed
Jan 03 2003
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Issued
Apr 06 2004
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Expiry
Apr 06 2018
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Assg.orig
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Entity
unknown
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8
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21
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n/a
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The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
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FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.
Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu, Lam, Allen K.
| Patent |
Priority |
Assignee |
Title |
| D505121, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
| D505122, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
| D588080, |
Sep 26 2007 |
GEM SERVICES, INC |
2021-8J matrix leadframe |
| D588557, |
Oct 02 2007 |
GEM SERVICES, INC |
4040-28J matrix leadframe |
| D761216, |
Dec 12 2014 |
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD |
LED leadframe |
| D803799, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
| D803800, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
| D803801, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
| Patent |
Priority |
Assignee |
Title |
| 3698074, |
|
|
|
| 4118859, |
Dec 01 1976 |
AMP Incorporated |
Packaging and assembly of sheet metal parts |
| 4234666, |
Jul 26 1978 |
AT & T TECHNOLOGIES, INC , |
Carrier tapes for semiconductor devices |
| 4298883, |
Apr 26 1977 |
Tokyo Shibaura Electric Co., Ltd. |
Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet |
| 4633582, |
Aug 14 1985 |
QT OPTOELECTRONICS |
Method for assembling an optoisolator and leadframe therefor |
| 4809054, |
Jul 25 1986 |
|
Semiconductor lead frame |
| 4818960, |
Apr 06 1987 |
TDK Corporation |
Composite part and method of manufacturing same |
| 4852250, |
Jan 19 1988 |
Stovokor Technology LLC |
Hermetically sealed package having an electronic component and method of making |
| 4865193, |
Jun 23 1987 |
Mitsubishi Denki Kabushiki Kaisha |
Tape carrier for tape automated bonding process and a method of producing the same |
| 5115299, |
Jul 13 1989 |
GTE Products Corporation |
Hermetically sealed chip carrier with ultra violet transparent cover |
| 5554886, |
Mar 30 1994 |
Goldstar Electron Co., Ltd. |
Lead frame and semiconductor package with such lead frame |
| 5900582, |
Jun 05 1992 |
Mitsubishi Denki Kabushiki Kaisha |
Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame |
| 6016918, |
Aug 18 1998 |
DIAL TOOL INDUSTRIES, INC , AN ILLINOIS CORPORATION |
Part carrier strip |
| 6170151, |
Mar 04 1997 |
Tessera, Inc. |
Universal unit strip/carrier frame assembly and methods |
| 6265761, |
May 07 1999 |
Maxim Integrated Products, Inc.; Maxim Integrated Products, Inc |
Semiconductor devices with improved lead frame structures |
| 6329710, |
Sep 13 1996 |
Micron Technology, Inc. |
Integrated circuit package electrical enhancement |
| 6389672, |
May 10 1996 |
Matsushita Electric Industrial Co., Ltd. |
Component assembling method and component assembling apparatus |
| 6486538, |
May 27 1999 |
Polaris Innovations Limited |
Chip carrier having ventilation channels |
| 6543512, |
Oct 28 1998 |
Micron Technology, Inc. |
Carrier, method and system for handling semiconductor components |
| 6566740, |
Mar 23 2000 |
Mitsui High-Tec INC |
Lead frame for a semiconductor device and method of manufacturing a semiconductor device |
| D465207, |
Jun 08 2001 |
GEM SERVICES, INC |
Leadframe matrix for a surface mount package |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 03 2003 | | GEM Services, Inc. | (assignment on the face of the patent) | | / |
| Jan 20 2003 | HARNDEN, JAMES | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0259 |
pdf |
| Jan 20 2003 | WILLIAMS, RICHARD K | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0259 |
pdf |
| Jan 27 2003 | CHIA, ANTHONY | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0259 |
pdf |
| Jan 27 2003 | WEIBING, CHU | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0259 |
pdf |
| Jan 30 2003 | LAM, ALLEN K | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0259 |
pdf |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a