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Patent
   D505121
Priority
Jan 03 2003
Filed
Jan 03 2003
Issued
May 17 2005
Expiry
May 17 2019

TERM.DISCL.
Inventors
Williams, …
Assg.orig
GEM Servic…
Assg.curr
GEM SERVIC…
Entity
unknown
Referenced by
6
References
29
Maint.:
n/a
The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframes showing my new design.
INVENTORS:

Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu, Lam, Allen K.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D585847, Sep 08 2006 CREE LED, INC LED lighting tile
D588080, Sep 26 2007 GEM SERVICES, INC 2021-8J matrix leadframe
D588557, Oct 02 2007 GEM SERVICES, INC 4040-28J matrix leadframe
D803799, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
D803800, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
D803801, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
4118859, Dec 01 1976 AMP Incorporated Packaging and assembly of sheet metal parts
4234666, Jul 26 1978 AT & T TECHNOLOGIES, INC , Carrier tapes for semiconductor devices
4298883, Apr 26 1977 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
4633582, Aug 14 1985 QT OPTOELECTRONICS Method for assembling an optoisolator and leadframe therefor
4809054, Jul 25 1986 Semiconductor lead frame
4818960, Apr 06 1987 TDK Corporation Composite part and method of manufacturing same
4852250, Jan 19 1988 Stovokor Technology LLC Hermetically sealed package having an electronic component and method of making
4865193, Jun 23 1987 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
5115299, Jul 13 1989 GTE Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
5554886, Mar 30 1994 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
5900582, Jun 05 1992 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
6016918, Aug 18 1998 DIAL TOOL INDUSTRIES, INC , AN ILLINOIS CORPORATION Part carrier strip
6028350, Feb 09 1998 GLOBALFOUNDRIES Inc Lead frame with strip-shaped die bonding pad
6377742, Mar 16 1998 SUMITOMO ELECTRIC INDUSTRIES, LTD Lead frame, optical module, and a method of optical module
20020106835,
D465207, Jun 08 2001 GEM SERVICES, INC Leadframe matrix for a surface mount package
D483336, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D483337, Nov 25 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484103, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484104, Nov 25 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484858, Nov 15 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D484859, Feb 07 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D485243, Oct 22 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D485244, Dec 17 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D485808, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D486802, Dec 17 2002 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D487431, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D487432, Feb 07 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D488136, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 03 2003GEM Services, Inc.(assignment on the face of the patent)
Jan 20 2003HARNDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135650279 pdf
Jan 20 2003WILLIAMS, RICHARD K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135650279 pdf
Jan 27 2003CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135650279 pdf
Jan 27 2003WEIBING, CHUGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135650279 pdf
Jan 30 2003LAM, ALLEN K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135650279 pdf
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