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Patent
D487431
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Priority
Jan 03 2003
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Filed
Jan 03 2003
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Issued
Mar 09 2004
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Expiry
Mar 09 2018
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Assg.orig
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Entity
unknown
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8
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8
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n/a
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The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
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FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.
Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu, Lam, Allen K.
Patent |
Priority |
Assignee |
Title |
D505121, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D505122, |
Jan 03 2003 |
GEM SERVICES, INC |
Portion of a matrix for surface mount package leadframe |
D588080, |
Sep 26 2007 |
GEM SERVICES, INC |
2021-8J matrix leadframe |
D588557, |
Oct 02 2007 |
GEM SERVICES, INC |
4040-28J matrix leadframe |
D761216, |
Dec 12 2014 |
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD |
LED leadframe |
D803799, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
D803800, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
D803801, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
Patent |
Priority |
Assignee |
Title |
3698074, |
|
|
|
6170151, |
Mar 04 1997 |
Tessera, Inc. |
Universal unit strip/carrier frame assembly and methods |
6265761, |
May 07 1999 |
Maxim Integrated Products, Inc.; Maxim Integrated Products, Inc |
Semiconductor devices with improved lead frame structures |
6329710, |
Sep 13 1996 |
Micron Technology, Inc. |
Integrated circuit package electrical enhancement |
6389672, |
May 10 1996 |
Matsushita Electric Industrial Co., Ltd. |
Component assembling method and component assembling apparatus |
6486538, |
May 27 1999 |
Polaris Innovations Limited |
Chip carrier having ventilation channels |
6543512, |
Oct 28 1998 |
Micron Technology, Inc. |
Carrier, method and system for handling semiconductor components |
6566740, |
Mar 23 2000 |
Mitsui High-Tec INC |
Lead frame for a semiconductor device and method of manufacturing a semiconductor device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 03 2003 | | GEM Services, Inc. | (assignment on the face of the patent) | | / |
Jan 20 2003 | HARNDEN, JAMES | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0257 |
pdf |
Jan 20 2003 | WILLIAMS, RICHARD K | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0257 |
pdf |
Jan 27 2003 | CHIA, ANTHONY | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0257 |
pdf |
Jan 27 2003 | WEIBING, CHU | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0257 |
pdf |
Jan 30 2003 | LAM, ALLEN K | GEM SERVICES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013561 | /0257 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
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