Patent
   D487431
Priority
Jan 03 2003
Filed
Jan 03 2003
Issued
Mar 09 2004
Expiry
Mar 09 2018
Assg.orig
Entity
unknown
8
8
n/a
The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu, Lam, Allen K.

Patent Priority Assignee Title
D505121, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D505122, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D588080, Sep 26 2007 GEM SERVICES, INC 2021-8J matrix leadframe
D588557, Oct 02 2007 GEM SERVICES, INC 4040-28J matrix leadframe
D761216, Dec 12 2014 JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD LED leadframe
D803799, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
D803800, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
D803801, Apr 20 2015 Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation Lead frame
Patent Priority Assignee Title
3698074,
6170151, Mar 04 1997 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
6265761, May 07 1999 Maxim Integrated Products, Inc.; Maxim Integrated Products, Inc Semiconductor devices with improved lead frame structures
6329710, Sep 13 1996 Micron Technology, Inc. Integrated circuit package electrical enhancement
6389672, May 10 1996 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
6486538, May 27 1999 Polaris Innovations Limited Chip carrier having ventilation channels
6543512, Oct 28 1998 Micron Technology, Inc. Carrier, method and system for handling semiconductor components
6566740, Mar 23 2000 Mitsui High-Tec INC Lead frame for a semiconductor device and method of manufacturing a semiconductor device
//////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 03 2003GEM Services, Inc.(assignment on the face of the patent)
Jan 20 2003HARNDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610257 pdf
Jan 20 2003WILLIAMS, RICHARD K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610257 pdf
Jan 27 2003CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610257 pdf
Jan 27 2003WEIBING, CHUGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610257 pdf
Jan 30 2003LAM, ALLEN K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0135610257 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule