Portion of a matrix for surface mount package leadframe

The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe showing my new design.

Patent	Priority	Assignee	Title
D505121,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D505122,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D513608,	Jan 03 2003	GEM SERVICES, INC	Portion of a matrix for surface mount package leadframe
D588080,	Sep 26 2007	GEM SERVICES, INC	2021-8J matrix leadframe
D588557,	Oct 02 2007	GEM SERVICES, INC	4040-28J matrix leadframe
D761216,	Dec 12 2014	JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD	LED leadframe
D803799,	Apr 20 2015	Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation	Lead frame
D803800,	Apr 20 2015	Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation	Lead frame
D803801,	Apr 20 2015	Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation	Lead frame

Patent	Priority	Assignee	Title
4118859,	Dec 01 1976	AMP Incorporated	Packaging and assembly of sheet metal parts
4234666,	Jul 26 1978	AT & T TECHNOLOGIES, INC ,	Carrier tapes for semiconductor devices
4298883,	Apr 26 1977	Tokyo Shibaura Electric Co., Ltd.	Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
4633582,	Aug 14 1985	QT OPTOELECTRONICS	Method for assembling an optoisolator and leadframe therefor
4809054,	Jul 25 1986		Semiconductor lead frame
4818960,	Apr 06 1987	TDK Corporation	Composite part and method of manufacturing same
4852250,	Jan 19 1988	Stovokor Technology LLC	Hermetically sealed package having an electronic component and method of making
4865193,	Jun 23 1987	Mitsubishi Denki Kabushiki Kaisha	Tape carrier for tape automated bonding process and a method of producing the same
5115299,	Jul 13 1989	GTE Products Corporation	Hermetically sealed chip carrier with ultra violet transparent cover
5554886,	Mar 30 1994	Goldstar Electron Co., Ltd.	Lead frame and semiconductor package with such lead frame
5900582,	Jun 05 1992	Mitsubishi Denki Kabushiki Kaisha	Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
6016918,	Aug 18 1998	DIAL TOOL INDUSTRIES, INC , AN ILLINOIS CORPORATION	Part carrier strip
D465207,	Jun 08 2001	GEM SERVICES, INC	Leadframe matrix for a surface mount package

/////

Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Feb 07 2003		GEM Services, Inc.	(assignment on the face of the patent)
Mar 06 2003	HARNDEN, JAMES	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	013604	0255	pdf
Mar 10 2003	WILLIAMS, RICHARD K	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	013604	0255	pdf
Mar 25 2003	CHIA, ANTHONY	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	013604	0255	pdf
Mar 29 2003	WEIBING, CHU	GEM SERVICES, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	013604	0255	pdf

n/a

Date	Maintenance Fee Events

n/a

Date	Maintenance Schedule