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Patent
D492266
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Priority
Nov 15 2002
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Filed
Nov 15 2002
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Issued
Jun 29 2004
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Expiry
Jun 29 2018
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Assg.orig
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Entity
unknown
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10
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21
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n/a
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The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
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FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a portion of a matrix surface mount package leadframes showing my new design.
Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu
| Patent |
Priority |
Assignee |
Title |
| D588080, |
Sep 26 2007 |
GEM SERVICES, INC |
2021-8J matrix leadframe |
| D588557, |
Oct 02 2007 |
GEM SERVICES, INC |
4040-28J matrix leadframe |
| D761216, |
Dec 12 2014 |
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD |
LED leadframe |
| D803799, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
| D803800, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
| D803801, |
Apr 20 2015 |
Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation |
Lead frame |
| ER1445, |
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| ER3604, |
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| ER383, |
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| ER6265, |
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| Patent |
Priority |
Assignee |
Title |
| 3698074, |
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|
| 4118859, |
Dec 01 1976 |
AMP Incorporated |
Packaging and assembly of sheet metal parts |
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AT & T TECHNOLOGIES, INC , |
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Semiconductor lead frame |
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Mar 23 2000 |
Mitsui High-Tec INC |
Lead frame for a semiconductor device and method of manufacturing a semiconductor device |
| D465207, |
Jun 08 2001 |
GEM SERVICES, INC |
Leadframe matrix for a surface mount package |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a