Patent
   D471165
Priority
May 15 2001
Filed
May 15 2001
Issued
Mar 04 2003
Expiry
Mar 04 2017

TERM.DISCL.
Assg.orig
Entity
unknown
15
7
n/a
The ornamental design for a surface mount package, as shown and described.

FIG. 1 is a perspective view of a surface mount package showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof:

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 the right side elevational view thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Williams, Richard K., Harnden, James, Chia, Anthony, Weibing, Chu

Patent Priority Assignee Title
10256385, Oct 31 2007 CREELED, INC Light emitting die (LED) packages and related methods
7166496, Aug 17 2005 Ciclon Semiconductor Device Corp. Method of making a packaged semiconductor device
7446375, Mar 14 2006 Ciclon Semiconductor Device Corp.; CICLON SEMICONDUCTOR DEVICE CORP Quasi-vertical LDMOS device having closed cell layout
7504733, Aug 17 2005 Ciclon Semiconductor Device Corp.; CICLON SEMICONDUCTOR DEVICE CORP Semiconductor die package
7560808, Oct 19 2005 Texas Instruments Lehigh Valley Incorporated Chip scale power LDMOS device
8049312, Jan 12 2009 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
8304903, Aug 14 2006 Texas Instruments Incorporated Wirebond-less semiconductor package
D505122, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D513608, Jan 03 2003 GEM SERVICES, INC Portion of a matrix for surface mount package leadframe
D594827, Dec 07 2006 CREE LED, INC Lamp package
D729182, Apr 24 2014 CURRENT WAYS, INC Integrated board mount device
D803795, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803796, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803797, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803798, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
Patent Priority Assignee Title
4984062, Mar 30 1987 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device
5224021, Oct 20 1989 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Surface-mount network device
5446623, Aug 24 1993 Rohm Co. Ltd. Surface mounting type polar electronic component
5625226, Sep 19 1994 International Rectifier Corporation Surface mount package with improved heat transfer
6040626, Sep 25 1998 Infineon Technologies Americas Corp Semiconductor package
6211462, Nov 05 1998 Texas Instruments Incorporated Low inductance power package for integrated circuits
6249041, Jun 02 1998 Siliconix Incorporated IC chip package with directly connected leads
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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 15 2001GEM Services, Inc.(assignment on the face of the patent)
Sep 24 2001HARNDEN, JAMESGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124710690 pdf
Oct 12 2001WILLIAMS, RICHARD K GEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124710690 pdf
Oct 22 2001CHIA, ANTHONYGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124710690 pdf
Oct 22 2001WEIBING, CHUGEM SERVICES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0124710690 pdf
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