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The ornamental design for a semiconductor device, as shown and described. |
FIG. 1 is a front elevational view of a semiconductor device, showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a cross-sectional view thereof, taken along line 7--7 in FIG. 1;
FIG. 8 is a cross-sectional view thereof, taken along line 8--8 in FIG. 1; and,
FIG. 9 is a front, right side and bottom perspective view thereof.
Majumdar, Gourab, Kawafuji, Hisashi, Shinohara, Toshiaki, Iwasaki, Mitsutaka
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 19 1999 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010038 | /0817 | |
May 22 1999 | SHINOHARA, TOSHIAKI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010038 | /0817 | |
May 25 1999 | MAJUMDAR, GOURAB | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010038 | /0817 | |
May 26 1999 | IWASAKI, MITSUTAKA | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010038 | /0817 | |
Jun 15 1999 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / |
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