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Patent
   D288922
Priority
Apr 19 1984
Filed
Apr 19 1984
Issued
Mar 24 1987
Expiry
Mar 24 2001
Inventors
Olla, Mich…
Assg.orig
MOSTEK COR…
Assg.curr
SGS-Thomso…
Entity
unknown
Referenced by
31
References
2
Maint.:
n/a
The ornamental design for a zero power random access memory package, as shown and described.

FIG. 1 is a perspective view of a zero power random access memory package showing my new design;

FIG. 2 is a top plan view thereof on a reduced scale;

FIG. 3 is a side elevational view on a reduced scale, the opposite end being a mirror image;

FIG. 4 is an end elevational view thereof on a reduced scale, the opposite end being a mirror image; and

FIG. 5 is a bottom plan view thereof on a reduced scale.
INVENTORS:

Olla, Michael A.

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D304193, Aug 21 1986 Mitel Corporation Cartridge for telephone system equipment cabinet
D316251, Dec 19 1988 Mosaic Semiconductor, Inc.; MOSAIC SEMICONDUCTOR, INC , 7420 CARROLL ROAD, SAN DIEGO, CA 92121, A CA CORP In-line semiconductor package
D336897, Jun 26 1990 Microwafer system for processing and storing audio visual information
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D372707, Dec 30 1994 THE CHASE MANHATTAN BANK, AS COLLATERAL AGENT Packaging for memory device
D394244, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D401912, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D427977, Jun 18 1999 FUKIJURA LTD Piezoelectric conversion type semiconductor device
D428859, Jan 28 1999 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D459705, Mar 06 2001 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
D466485, May 23 2001 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
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D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
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D777124, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D839220, Feb 19 2013 Sony Corporation Semiconductor device
D877102, Dec 28 2017 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
D906271, Apr 13 2018 ROHM CO , LTD Semiconductor module
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
D978809, Apr 13 2018 Rohm Co., Ltd. Semiconductor module
ER1981,
ER2039,
ER3499,
ER3563,
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
4012579, Feb 21 1975 Allen-Bradley Company Encapsulated microcircuit package and method for assembly thereof
4355719, Aug 18 1980 National Semiconductor Corporation Mechanical shock and impact resistant ceramic semiconductor package and method of making the same
ASSIGNMENT RECORDS    Assignment records on the USPTO
///////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 18 1983OLLA, MICHAEL A MOSTEK CORPORATION, 1215 WEST CROSBY ROAD, CARROLLTON, TX 75006, A DE CORP ASSIGNMENT OF ASSIGNORS INTEREST 0042520374 pdf
Apr 19 1984Thomson Components-Mostek Corporation(assignment on the face of the patent)
Jul 21 1987CTU OF DELAWARE, INC , FORMERLY MOSTEK CORPORATIONThomson Components-Mostek CorporationASSIGNMENT OF ASSIGNORS INTEREST 0048100156 pdf
Oct 23 1987Thomson Components-Mostek CorporationSGS-Thomson Microelectronics, IncCHANGE OF NAME SEE DOCUMENT FOR DETAILS EFFECTIVE ON 11 15 19870052700714 pdf
Dec 24 1987SGS SEMICONDUCTOR CORPORATION, A CORP OF DESGS-Thomson Microelectronics, IncMERGER SEE DOCUMENT FOR DETAILS EFFECTIVE ON 12 31 1987DE0052700725 pdf
Dec 24 1987THOMSON HOLDINGS DELAWARE INC , A CORP OF DESGS-Thomson Microelectronics, IncMERGER SEE DOCUMENT FOR DETAILS EFFECTIVE ON 12 31 1987DE0052700725 pdf
Dec 24 1987SGS-THOMSON MICROELECTRONICS, INC A CORP OF DE MERGED INTO SGS-Thomson Microelectronics, IncMERGER SEE DOCUMENT FOR DETAILS EFFECTIVE ON 12 31 1987DE0052700725 pdf
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