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Patent
D770994
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Priority
Apr 02 2014
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Filed
Jun 20 2016
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Issued
Nov 08 2016
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Expiry
Nov 08 2031
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Assg.orig
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Entity
unknown
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32
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37
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n/a
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The ornamental design for a power semiconductor device, as shown and described.
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FIG. 1 is a front, right side, bottom perspective view of a power semiconductor device showing our new design;
FIG. 2 is a rear, left side, top perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines shown represent unclaimed subject matter of a power semiconductor device and form no part of the claimed design.
Kawafuji, Hisashi, Kato, Masahiro, Nakagawa, Shinya, Hasegawa, Maki, Iwagami, Toru
Patent |
Priority |
Assignee |
Title |
D783550, |
Sep 29 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D785577, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D805485, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D836073, |
Jan 25 2017 |
Shindengen Electric Manufacturing Co., Ltd. |
Solid state relay |
D836565, |
Jan 25 2017 |
Shindengen Electric Manufacturing Co., Ltd. |
Solid state relay |
D839220, |
Feb 19 2013 |
Sony Corporation |
Semiconductor device |
D852765, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D853343, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D856947, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D859334, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D877102, |
Dec 28 2017 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor module |
D888673, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D903613, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D906271, |
Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
D913978, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D914621, |
May 14 2019 |
Rohm Co., Ltd. |
Packaged semiconductor module |
D920264, |
Nov 27 2019 |
The Noco Company |
Semiconductor device |
D932452, |
Nov 27 2019 |
The Noco Company |
Semiconductor device |
D971863, |
Jan 28 2020 |
Rohm Co., Ltd. |
Semiconductor module |
D972516, |
Jan 28 2020 |
Rohm Co., Ltd. |
Semiconductor module |
D978809, |
Apr 13 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D981356, |
Jan 28 2020 |
Rohm Co., Ltd. |
Semiconductor module |
ER3437, |
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ER4320, |
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ER4634, |
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ER4796, |
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ER5999, |
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ER6066, |
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ER6398, |
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ER6905, |
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ER9811, |
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Patent |
Priority |
Assignee |
Title |
3602846, |
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3762039, |
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3825876, |
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3846734, |
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4663833, |
May 14 1984 |
Oki Electric Industry Co. Ltd. |
Method for manufacturing IC plastic package with window |
D288922, |
Apr 19 1984 |
SGS-Thomson Microelectronics, Inc |
Zero power random access memory package |
D358806, |
Sep 24 1993 |
SGS-Thomson Microelectronics, Inc |
Socketed integrated circuit package |
D359028, |
Sep 02 1993 |
SGS-Thomson Microelectronics, Inc |
Socketed integrated circuit package |
D394244, |
Nov 27 1995 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D401912, |
Nov 27 1995 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D418485, |
Sep 29 1998 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D421969, |
Sep 29 1998 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D448739, |
Sep 12 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D459705, |
Mar 06 2001 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor package |
D470825, |
Dec 28 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D472530, |
Nov 30 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D505399, |
Mar 14 2003 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D505400, |
Mar 26 2004 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D539761, |
Aug 22 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548202, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548203, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D587662, |
Dec 20 2007 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D589012, |
Mar 17 2008 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D606951, |
Nov 14 2008 |
Fuji Electric Device Technology Co, Ltd. |
Semiconductor device |
D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D674760, |
Apr 01 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
D689446, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D717253, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717254, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717255, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717256, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719113, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719537, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D719926, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a