Patent
   D770994
Priority
Apr 02 2014
Filed
Jun 20 2016
Issued
Nov 08 2016
Expiry
Nov 08 2031
Assg.orig
Entity
unknown
32
37
n/a
The ornamental design for a power semiconductor device, as shown and described.

FIG. 1 is a front, right side, bottom perspective view of a power semiconductor device showing our new design;

FIG. 2 is a rear, left side, top perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines shown represent unclaimed subject matter of a power semiconductor device and form no part of the claimed design.

Kawafuji, Hisashi, Kato, Masahiro, Nakagawa, Shinya, Hasegawa, Maki, Iwagami, Toru

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 04 2014HASEGAWA, MAKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570973 pdf
Sep 04 2014KATO, MASAHIROMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570973 pdf
Sep 04 2014NAKAGAWA, SHINYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570973 pdf
Sep 04 2014KAWAFUJI, HISASHIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570973 pdf
Sep 04 2014IWAGAMI, TORUMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0389570973 pdf
Jun 20 2016Mitsubishi Electric Corporation(assignment on the face of the patent)
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