Patent
   D505400
Priority
Mar 26 2004
Filed
Sep 24 2004
Issued
May 24 2005
Expiry
May 24 2019
Assg.orig
Entity
unknown
36
8
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof; and,

FIG. 8 is an enlarged cross-sectional view thereof and, taken along line 8—8 of FIG. 2, with the internal system omitted.

Kawafuji, Hisashi, Takeshita, Tatsuyuki

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 18 2004KAWAFUJI, HISASHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0158320992 pdf
Aug 18 2004TAKESHITA, TATSUYUKIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0158320992 pdf
Sep 24 2004Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
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