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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is an enlarged cross-sectional view thereof and, taken along line 8—8 of FIG. 2, with the internal system omitted.
Kawafuji, Hisashi, Takeshita, Tatsuyuki
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Aug 18 2004 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015832 | /0992 | |
Aug 18 2004 | TAKESHITA, TATSUYUKI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015832 | /0992 | |
Sep 24 2004 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / |
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