Semiconductor module

Abstract

Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor module showing my new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view thereof, the left side view being a mirror image of FIG. 7;

FIG. 8 is a front, top and right side perspective view of a second embodiment of a semiconductor module showing my new design;

FIG. 9 is a rear, bottom and left side perspective view thereof;

FIG. 10 is a front view thereof;

FIG. 11 is a rear view thereof;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a right side view thereof, the left side view being a mirror image of FIG. 14.

The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The oblique line shading shown in the drawings indicates transparent parts.

Claims

The ornamental design for a semiconductor module, as shown and described.