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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.
Yoshida, Hiroshi, Kawafuji, Hisashi
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 01 2003 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
| May 23 2003 | YOSHIDA, HIROSHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014369 | /0215 | |
| May 23 2003 | KAWAFUJI, HISASHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014369 | /0215 |
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