FIG. 1 is a front, top, right side perspective view of a semiconductor module showing my new design;
FIG. 2 is a rear, bottom, left side perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevation view thereof;
FIG. 8 is a left side elevation view thereof; and,
FIG. 9 is a cross sectional front elevation view thereof, taken in the direction of line 9-9 in FIG. 5.
In FIGS. 2 and 6, the oblique line shading shown on the bottom side indicates a translucent surface.
Patent |
Priority |
Assignee |
Title |
3602846, |
|
|
|
3762039, |
|
|
|
3825876, |
|
|
|
3846734, |
|
|
|
4391408, |
Sep 05 1980 |
Thomas & Betts International, Inc |
Low insertion force connector |
4663833, |
May 14 1984 |
Oki Electric Industry Co. Ltd. |
Method for manufacturing IC plastic package with window |
4916519, |
May 30 1989 |
International Business Machines Corporation |
Semiconductor package |
4987474, |
Sep 18 1987 |
Hitachi, Ltd. |
Semiconductor device and method of manufacturing the same |
5557504, |
Aug 31 1993 |
SGS-Thomson Microelectronics, Inc. |
Surface mountable integrated circuit package with detachable module |
5757070, |
Oct 24 1995 |
ALTERA CORPORATION CORPORATION OF DELAWARE |
Integrated circuit package |
7361983, |
Jul 26 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
9418975, |
Mar 24 2015 |
Mitsubishi Electric Corporation |
Semiconductor module, power conversion device, and method for manufacturing semiconductor module |
20010038143, |
|
|
|
20030042584, |
|
|
|
20080142948, |
|
|
|
20100149774, |
|
|
|
D357462, |
Sep 16 1993 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
D357901, |
Sep 27 1993 |
Telefonaktiebolaget L M Ericsson |
Power supply unit |
D358806, |
Sep 24 1993 |
SGS-Thomson Microelectronics, Inc |
Socketed integrated circuit package |
D359028, |
Sep 02 1993 |
SGS-Thomson Microelectronics, Inc |
Socketed integrated circuit package |
D360619, |
Sep 16 1993 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
D394244, |
Nov 27 1995 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D396211, |
Sep 09 1996 |
FUJI ELECTRIC CO , LTD |
Integrated circuit device |
D401912, |
Nov 27 1995 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D448739, |
Sep 12 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D466485, |
May 23 2001 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package |
D470825, |
Dec 28 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D505399, |
Mar 14 2003 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D505400, |
Mar 26 2004 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D539761, |
Aug 22 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548202, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D648682, |
Mar 31 2011 |
Cheng Uei Precision Industry Co., Ltd. |
Double-card connector |
D674760, |
Apr 01 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D717253, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717254, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717255, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717256, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719113, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719537, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D766851, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D767516, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D769834, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D770994, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D773412, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D773413, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D783549, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D783550, |
Sep 29 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D805485, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D810036, |
Nov 08 2016 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D814431, |
May 15 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D852765, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D853342, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D859334, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D864884, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D873226, |
Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
D873227, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D874411, |
Apr 13 2008 |
ROHM CO , LTD |
Semiconductor module |
D874412, |
Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
D877102, |
Dec 28 2017 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor module |
D877708, |
Oct 17 2013 |
Vicor Corporation |
Electrical terminal |
D884662, |
Jun 01 2018 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D888673, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
JP1145764, |
|
|
|
JP1146361, |
|
|
|
JP1146362, |
|
|
|
JP1146363, |
|
|
|
JP1305812, |
|
|
|
JP1551590, |
|
|
|
JP1565636, |
|
|
|
JP1578687, |
|
|
|