Patent
   D913978
Priority
Jun 26 2018
Filed
Dec 12 2018
Issued
Mar 23 2021
Expiry
Mar 23 2036
Assg.orig
Entity
unknown
6
72
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front, top, right side perspective view of a semiconductor module showing my new design;

FIG. 2 is a rear, bottom, left side perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side elevation view thereof;

FIG. 8 is a left side elevation view thereof; and,

FIG. 9 is a cross sectional front elevation view thereof, taken in the direction of line 9-9 in FIG. 5.

In FIGS. 2 and 6, the oblique line shading shown on the bottom side indicates a translucent surface.

Furutani, Ryuichi

Patent Priority Assignee Title
D936025, Dec 26 2018 LG ENERGY SOLUTION, LTD Flexible printed circuit board for battery module
D937791, Dec 26 2018 LG ENERGY SOLUTION, LTD Flexible printed circuit board for battery module
D962182, Mar 27 2019 GUDENG PRECISION INDUSTRIAL CO., LTD. Reticle pod connecting frame
D971863, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D972516, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D981356, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
Patent Priority Assignee Title
3602846,
3762039,
3825876,
3846734,
4391408, Sep 05 1980 Thomas & Betts International, Inc Low insertion force connector
4663833, May 14 1984 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
4916519, May 30 1989 International Business Machines Corporation Semiconductor package
4987474, Sep 18 1987 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
5557504, Aug 31 1993 SGS-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
5757070, Oct 24 1995 ALTERA CORPORATION CORPORATION OF DELAWARE Integrated circuit package
7361983, Jul 26 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
9418975, Mar 24 2015 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
20010038143,
20030042584,
20080142948,
20100149774,
D357462, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D357901, Sep 27 1993 Telefonaktiebolaget L M Ericsson Power supply unit
D358806, Sep 24 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D360619, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D394244, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D396211, Sep 09 1996 FUJI ELECTRIC CO , LTD Integrated circuit device
D401912, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D448739, Sep 12 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D466485, May 23 2001 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
D470825, Dec 28 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D505399, Mar 14 2003 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D505400, Mar 26 2004 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D648682, Mar 31 2011 Cheng Uei Precision Industry Co., Ltd. Double-card connector
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D717253, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717254, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717255, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717256, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719113, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D766851, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D767516, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773413, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D783549, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D810036, Nov 08 2016 Fuji Electric Co., Ltd. Semiconductor module
D814431, May 15 2015 Mitsubishi Electric Corporation Power semiconductor device
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853342, Feb 28 2017 Infineon Technologies AG High-performance semiconductor module
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864135, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864884, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
D873226, Apr 13 2018 ROHM CO , LTD Semiconductor module
D873227, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
D874411, Apr 13 2008 ROHM CO , LTD Semiconductor module
D874412, Apr 13 2018 ROHM CO , LTD Semiconductor module
D877102, Dec 28 2017 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
D877708, Oct 17 2013 Vicor Corporation Electrical terminal
D884662, Jun 01 2018 Fuji Electric Co., Ltd. Semiconductor module
D888673, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
JP1145764,
JP1146361,
JP1146362,
JP1146363,
JP1305812,
JP1551590,
JP1565636,
JP1578687,
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 15 2018FURUTANI, RYUICHIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0477690488 pdf
Dec 12 2018Rohm Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule