Semiconductor package

Abstract

Description

FIG. 1 is a front, plan and right side perspective view of a semiconductor package showing our new design;

FIG. 2 is a front, bottom and right side perspective view thereof;

FIG. 3 is a rear, plan and left side perspective view thereof;

FIG. 4 is a rear, bottom and left side perspective view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a left side elevational view thereof; and,

FIG. 10 is a right side elevational view thereof.

Claims

The ornamental design for a semiconductor package, as shown and described.