Patent
   D906271
Priority
Apr 13 2018
Filed
Oct 09 2018
Issued
Dec 29 2020
Expiry
Dec 29 2035
Assg.orig
Entity
unknown
9
57
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view, the left side view being identical to FIG. 7;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 5; and,

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5.

The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Kanda, Takumi

Patent Priority Assignee Title
D971863, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D972516, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 09 2018Rohm Co., Ltd.(assignment on the face of the patent)
Nov 15 2018HAYASHIGUCHI, MASASHIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0480030507 pdf
Nov 16 2018KANDA, TAKUMI ROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0480030507 pdf
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