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Patent
D810036
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Priority
Nov 08 2016
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Filed
Mar 27 2017
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Issued
Feb 13 2018
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Expiry
Feb 13 2033
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Assg.orig
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Entity
unknown
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13
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42
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n/a
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The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a left side view of the semiconductor module of FIG. 1;
FIG. 4 is a right side view of the semiconductor module of FIG. 1;
FIG. 5 is a top view of the semiconductor module of FIG. 1;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,
FIG. 7 is a top, front, right side perspective view of the semiconductor module of FIG. 1.
The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.
Takahashi, Hideaki, Taoka, Masahiro, Oose, Tomofumi, Sawayanagi, Satoshi
Patent |
Priority |
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Semiconductor module |
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Jan 31 2017 |
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Heatsink |
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Mitsubishi Electric Corporation |
Semiconductor device |
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Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor module |
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Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
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Rohm Co., Ltd. |
Semiconductor module |
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ROHM CO , LTD |
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Jun 26 2018 |
Rohm Co., Ltd. |
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D978809, |
Apr 13 2018 |
Rohm Co., Ltd. |
Semiconductor module |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a