Patent
   D686174
Priority
Aug 12 2011
Filed
Dec 13 2011
Issued
Jul 16 2013
Expiry
Jul 16 2027
Assg.orig
Entity
unknown
71
13
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a first perspective view of front, bottom and right side of a semiconductor device showing our new design;

FIG. 2 is a perspective view of rear, bottom and right side thereof;

FIG. 3 is a second perspective view of front, bottom and right side thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a right side view thereof;

FIG. 8 is a top plan view thereof; and,

FIG. 9 is a bottom view thereof.

The portions of the article in broken lines are shown for illustrative purposes only and form no part of the claimed design.

Soyano, Shin

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Oct 04 2011SOYANO, SHINFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0273760983 pdf
Dec 13 2011FUJI ELECTRIC CO., LTD(assignment on the face of the patent)
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