Patent
   D476959
Priority
Jul 31 2002
Filed
Jul 31 2002
Issued
Jul 08 2003
Expiry
Jul 08 2017
Assg.orig
Entity
unknown
72
8
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Yamada, Junji, Saiki, Seiji

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 31 2002Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
Aug 30 2002YAMADA, JUNJIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0133700924 pdf
Aug 30 2002SAIKI, SEIJIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0133700924 pdf
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