The ornamental design for the power semiconductor device, as shown and described.
FIG. 1 is a perspective view of the front, left and bottom sides of a power semiconductor device showing our new design;
FIG. 2 is a perspective view of the front, right and top sides thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof;
FIG. 8 is a bottom view thereof;
FIG. 9 is an end view of cutting part at 9-9, with omitting the interior mechanism thereof; and,
FIG. 10 is an end view of cutting part at 10-10, with omitting the interior mechanism thereof.
The broken line showing of unclaimed portion of the power semiconductor device is for the purpose of illustrating environmental structure only and forms no part of the claimed design.