Patent
   D357672
Priority
Sep 16 1993
Filed
Feb 28 1994
Issued
Apr 25 1995
Expiry
Apr 25 2009
Assg.orig
Entity
unknown
56
4
n/a
The ornamental design for a hybric integrated circuit for electric power control, as shown.

FIG. 1 is a perspective view of the top, front and right side of a hybrid integrated circuit for electric power control showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Soyano, Shin, Terasawa, Noriho

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D389808, Jan 09 1996 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D466076, Jun 18 2001 Kabushiki Kaisha Toshiba Power converter
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D503149, May 19 2003 Kabushiki Kaisha Toshiba Power converter
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D689446, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D693318, Oct 27 2011 SUMITOMO ELECTRIC INDUSTRIES, LTD Semiconductor module for power conversion
D694724, Oct 03 2012 HONDA MOTOR CO , LTD ; FUJI ELECTRIC CO , LTD Semiconductor device
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
D704670, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D706232, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor device
D710317, Jan 24 2013 Fuji Electric Co., Inc. Semiconductor device
D710318, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D710319, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D745476, Oct 19 2012 Solumatics CVBA Print board
D759604, Jun 17 2015 Mitsubishi Electric Corporation Semiconductor device
D761746, Nov 04 2014 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
D762185, Aug 21 2014 Infineon Technologies AG Power semiconductor module
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D766851, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D767516, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D772184, Dec 24 2014 Fuji Electric Co., Ltd. Semiconductor module
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773413, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D774479, Nov 28 2014 Fuji Electric Co., Ltd. Semiconductor module
D775091, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D775593, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D776071, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D778839, Jan 08 2015 GLUX VISUAL EFFECTS TECH (SHENZHEN) CO., LTD; GLUX VISUAL EFFECTS TECH SHENZHEN CO , LTD LED module
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D810036, Nov 08 2016 Fuji Electric Co., Ltd. Semiconductor module
D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D814431, May 15 2015 Mitsubishi Electric Corporation Power semiconductor device
D814433, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D827590, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D827591, Oct 31 2016 Fuji Electric Co., Ltd. Semiconductor module
D827593, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D832211, May 23 2016 Ultralife Corporation Modular component housing
D847103, Sep 07 2017 ROHM CO , LTD Power semiconductor module
D847104, Sep 29 2017 ROHM CO , LTD Power semiconductor module
D851612, Jun 30 2017 MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. Electrical module
D858467, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D864132, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D873227, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
D875058, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D879729, Jun 30 2017 MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. Electrical module
Patent Priority Assignee Title
4630174, Oct 31 1983 TELEDYNE INDUSTRIES, INC Circuit package with external circuit board and connection
5057648, Nov 20 1989 Micron Technology, Inc High voltage hybrid package
JP402154457,
JP404030459,
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 10 1994TERASAWA, NORIHOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068950473 pdf
Feb 10 1994SOYANO, SHINFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068950473 pdf
Feb 28 1994Fuji Electric Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule