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Patent
D827591
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Priority
Oct 31 2016
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Filed
Apr 20 2017
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Issued
Sep 04 2018
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Expiry
Sep 04 2033
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Assg.orig
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Entity
unknown
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12
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37
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n/a
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The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a left side view of the semiconductor module of FIG. 1;
FIG. 4 is a right side view of the semiconductor module of FIG. 1;
FIG. 5 is a top view of the semiconductor module of FIG. 1;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1;
FIG. 7 is a top, front, and right side perspective view of the semiconductor module of FIG. 1; and,
FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 5.
Ikeda, Yoshinari, Hori, Motohito, Hinata, Yuichiro, Daicho, Norihiro
Patent |
Priority |
Assignee |
Title |
D847103, |
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FUJI ELECTRIC CO., LTD |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a