Patent
   D754084
Priority
Aug 21 2013
Filed
Nov 08 2013
Issued
Apr 19 2016
Expiry
Apr 19 2030
Assg.orig
Entity
unknown
38
34
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a top, right and rear side perspective view of a semiconductor device, showing my new design;

FIG. 2 is a front, right and bottom side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is another top, right, and rear side perspective view thereof, shown in a used condition; and,

FIG. 10 is another rear elevational view thereof, shown in a used condition.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Kawase, Tatsuya

Patent Priority Assignee Title
D785577, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D790491, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D798832, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D799439, May 31 2016 Rohm Co., Ltd. Power converting semiconductor module
D803663, Nov 20 2014 Green Inova Lighting Technology Limited Bracket
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D810036, Nov 08 2016 Fuji Electric Co., Ltd. Semiconductor module
D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D814433, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D822629, Jan 26 2017 Kyocera Corporation Semiconductor package
D827591, Oct 31 2016 Fuji Electric Co., Ltd. Semiconductor module
D827593, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D839220, Feb 19 2013 Sony Corporation Semiconductor device
D847103, Sep 07 2017 ROHM CO , LTD Power semiconductor module
D847104, Sep 29 2017 ROHM CO , LTD Power semiconductor module
D851612, Jun 30 2017 MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. Electrical module
D853342, Feb 28 2017 Infineon Technologies AG High-performance semiconductor module
D853978, Feb 28 2017 Infineon Technologies AG High-performance semiconductor module
D858467, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D864132, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D864882, Sep 27 2017 Hamamatsu Photonics K.K. Part for semiconductor device
D864883, Sep 27 2017 Hamamatsu Photonics K.K. Part for semiconductor device
D865690, Sep 27 2017 Hamamatsu Photonics K.K. Part for semiconductor device
D873227, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
D875058, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D879729, Jun 30 2017 MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. Electrical module
D884662, Jun 01 2018 Fuji Electric Co., Ltd. Semiconductor module
D903611, Mar 29 2019 Mitsubishi Electric Corporation Semiconductor device
D923591, Mar 15 2019 TAMURA CORPORATION Semiconductor driving circuit module
D927437, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D934188, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D934189, Aug 29 2019 Rohm Co., Ltd. Circuit board for power semiconductor module
D934190, Aug 29 2019 Rohm Co., Ltd. Circuit board for power semiconductor module
D934822, Aug 29 2019 Rohm Co., Ltd. Circuit board for power semiconductor module
D969761, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D976852, Apr 24 2020 Industrial Technology Research Institute Power module
D981354, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D981355, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
Patent Priority Assignee Title
5408128, Sep 15 1993 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
5410450, Dec 10 1991 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
6078501, Dec 22 1997 Omnirel LLC Power semiconductor module
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
8526199, May 07 2010 Mitsubishi Electric Corporation Semiconductor device
D364383, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364384, May 23 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364385, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D441727, Oct 04 2000 Sony Corporation Semiconductor element
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D525215, Jan 27 2004 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D689446, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
D703625, Dec 06 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Power semiconductor module
D704670, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D706232, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor device
D710317, Jan 24 2013 Fuji Electric Co., Inc. Semiconductor device
D710318, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D710319, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
JP1411990,
JP1412318,
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 08 2013Mitsubishi Electric Corporation(assignment on the face of the patent)
Nov 11 2013KAWASE, TATSUYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0317970017 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule