Patent
   D903611
Priority
Mar 29 2019
Filed
Jul 11 2019
Issued
Dec 01 2020
Expiry
Dec 01 2035
Assg.orig
Entity
unknown
16
36
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side view thereof; and,

FIG. 8 is a left side view thereof.

Higashikawa, Naoki, Sannai, Hiroya, Kawase, Tatsuya, Inokuchi, Seiichiro

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 20 2019SANNAI, HIROYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jun 20 2019KAWASE, TATSUYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jun 20 2019INOKUCHI, SEIICHIROMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jun 25 2019HIGASHIKAWA, NAOKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jul 11 2019Mitsubishi Electric Corporation(assignment on the face of the patent)
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