Patent
   D903611
Priority
Mar 29 2019
Filed
Jul 11 2019
Issued
Dec 01 2020
Expiry
Dec 01 2035
Assg.orig
Entity
unknown
17
36
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side view thereof; and,

FIG. 8 is a left side view thereof.

Higashikawa, Naoki, Sannai, Hiroya, Kawase, Tatsuya, Inokuchi, Seiichiro

Patent Priority Assignee Title
D920937, Mar 29 2019 SHINDENGEN ELECTRIC MANUFACTURING CO , LTD Power module device containing semiconductor elements
D923591, Mar 15 2019 TAMURA CORPORATION Semiconductor driving circuit module
D927437, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D934188, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D934189, Aug 29 2019 Rohm Co., Ltd. Circuit board for power semiconductor module
D934190, Aug 29 2019 Rohm Co., Ltd. Circuit board for power semiconductor module
D934822, Aug 29 2019 Rohm Co., Ltd. Circuit board for power semiconductor module
D952585, Mar 16 2020 DYNATRON CORPORATION Vapor chamber
D969761, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D974311, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
D975666, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
D976852, Apr 24 2020 Industrial Technology Research Institute Power module
D981354, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D981355, Aug 29 2019 Rohm Co., Ltd. Power semiconductor module
D984397, Mar 16 2021 Circuit board
ER7148,
ER7986,
Patent Priority Assignee Title
5347160, Sep 28 1992 Sundstrand Corporation Power semiconductor integrated circuit package
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
9418975, Mar 24 2015 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
20010038143,
20040227231,
20070126445,
20100149774,
20160276234,
D357671, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D389808, Jan 09 1996 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D689446, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
D754084, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D762185, Aug 21 2014 Infineon Technologies AG Power semiconductor module
D766851, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D772184, Dec 24 2014 Fuji Electric Co., Ltd. Semiconductor module
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D774479, Nov 28 2014 Fuji Electric Co., Ltd. Semiconductor module
D775593, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D776071, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D785577, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D799439, May 31 2016 Rohm Co., Ltd. Power converting semiconductor module
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D814431, May 15 2015 Mitsubishi Electric Corporation Power semiconductor device
D814433, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D864884, Oct 23 2017 Mitsubishi Electric Corporation Semiconductor device
JP1495189,
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 20 2019SANNAI, HIROYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jun 20 2019KAWASE, TATSUYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jun 20 2019INOKUCHI, SEIICHIROMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jun 25 2019HIGASHIKAWA, NAOKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0497260681 pdf
Jul 11 2019Mitsubishi Electric Corporation(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule