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Patent
D984397
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Priority
Mar 16 2021
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Filed
Mar 16 2021
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Issued
Apr 25 2023
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Expiry
Apr 25 2038
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Assg.orig
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Entity
unknown
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1
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12
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n/a
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The ornamental design for a circuit board, as shown and described.
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FIG. 1 is a perspective view of a circuit board showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines and lightened areas within the broken lines form no part of the claimed design.
Cai, Yidong
Patent |
Priority |
Assignee |
Title |
ER222, |
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Patent |
Priority |
Assignee |
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Jan 05 2015 |
Qorvo US, Inc |
Modular semiconductor package |
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Aug 06 2012 |
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Thin leadframe QFN package design of RF front-ends for mobile wireless communication |
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May 08 2015 |
Canon Kabushiki Kaisha |
Printed-circuit board, printed-wiring board, and electronic apparatus |
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Jan 26 2017 |
Nano Dimension Technologies, LTD. |
Chip embedded printed circuit boards and methods of fabrication |
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Apr 12 2018 |
Mitsubishi Electric Corporation |
Semiconductor device |
4069496, |
Dec 30 1976 |
Honeywell Information Systems Inc. |
Reusable fixture for an integrated circuit chip |
4575747, |
Sep 20 1982 |
Siemens Aktiengesellschaft |
Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges |
9645163, |
Aug 24 2011 |
CONTINENTAL TEVES AG & CO OHG |
Sensor with a single electrical carrier means |
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D805485, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Mar 29 2019 |
Mitsubishi Electric Corporation |
Semiconductor device |
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