FIG. 1 is a top, left and rear side perspective view of a semiconductor device, showing my new design;
FIG. 2 is bottom, right and rear side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is another top, left and rear side perspective view thereof, shown in a used condition mounted on a board shown in broken lines; and,
FIG. 10 is another rear view thereof, shown in a used condition mounted on a board shown in broken lines.
The broken lines shown in the drawing views in FIGS. 9 and 10 form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
D822627, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D822628, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D823270, |
Sep 30 2016 |
Rohm Co., Ltd. |
Semiconductor device |
D827591, |
Oct 31 2016 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D827593, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D851612, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D858467, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864132, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864884, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D873227, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D875058, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D879729, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D884662, |
Jun 01 2018 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D888673, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D903611, |
Mar 29 2019 |
Mitsubishi Electric Corporation |
Semiconductor device |
D903613, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D913978, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D923591, |
Mar 15 2019 |
TAMURA CORPORATION |
Semiconductor driving circuit module |
D927437, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D934188, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D934189, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934190, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934822, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D969761, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D981354, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D981355, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D984397, |
Mar 16 2021 |
|
Circuit board |
ER7148, |
|
|
|
Patent |
Priority |
Assignee |
Title |
3602846, |
|
|
|
3762039, |
|
|
|
3825876, |
|
|
|
3846734, |
|
|
|
4663833, |
May 14 1984 |
Oki Electric Industry Co. Ltd. |
Method for manufacturing IC plastic package with window |
4987474, |
Sep 18 1987 |
Hitachi, Ltd. |
Semiconductor device and method of manufacturing the same |
5347160, |
Sep 28 1992 |
Sundstrand Corporation |
Power semiconductor integrated circuit package |
5408128, |
Sep 15 1993 |
International Rectifier Corporation |
High power semiconductor device module with low thermal resistance and simplified manufacturing |
5410450, |
Dec 10 1991 |
Fuji Electric Co., Ltd. |
Internal wiring structure of a semiconductor device |
6078501, |
Dec 22 1997 |
Omnirel LLC |
Power semiconductor module |
6521983, |
Aug 29 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device for electric power |
6774465, |
Oct 05 2001 |
Semiconductor Components Industries, LLC |
Semiconductor power package module |
8526199, |
May 07 2010 |
Mitsubishi Electric Corporation |
Semiconductor device |
20010038143, |
|
|
|
20030042584, |
|
|
|
20100149774, |
|
|
|
20110044012, |
|
|
|
D364383, |
May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364384, |
May 23 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364385, |
May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D441726, |
Jul 14 1999 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element |
D441727, |
Oct 04 2000 |
Sony Corporation |
Semiconductor element |
D476959, |
Jul 31 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D525215, |
Jan 27 2004 |
Yamaichi Electronics Co., Ltd. |
Base for a semiconductor carrier |
D539761, |
Aug 22 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548202, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548203, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D587662, |
Dec 20 2007 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D589012, |
Mar 17 2008 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D606951, |
Nov 14 2008 |
Fuji Electric Device Technology Co, Ltd. |
Semiconductor device |
D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D674760, |
Apr 01 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
D689446, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D699693, |
Oct 03 2012 |
FUJI ELECTRIC CO , LTD |
Semiconductor device |
D703625, |
Dec 06 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Power semiconductor module |
D704670, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D704671, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D706232, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor device |
D710317, |
Jan 24 2013 |
Fuji Electric Co., Inc. |
Semiconductor device |
D710318, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D710319, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D712853, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
D719113, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719537, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D754084, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D759604, |
Jun 17 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D762185, |
Aug 21 2014 |
Infineon Technologies AG |
Power semiconductor module |
D762597, |
Aug 07 2014 |
Infineon Technologies AG |
Power semiconductor module |
D766851, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D767516, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D769834, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D770994, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D772182, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D772184, |
Dec 24 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D773412, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D773413, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D774479, |
Nov 28 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D775091, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D775593, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D776071, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D783550, |
Sep 29 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D785577, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
JP1411990, |
|
|
|
JP1412318, |
|
|
|