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Patent
D704670
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Priority
Jan 24 2013
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Filed
Jul 16 2013
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Issued
May 13 2014
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Expiry
May 13 2028
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Assg.orig
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Entity
unknown
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46
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21
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n/a
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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front view of a semiconductor device showing our new design;
FIG. 2 is a rear view of the semiconductor device of FIG. 1;
FIG. 3 is a left side view of the semiconductor device of FIG. 1;
FIG. 4 is a right side view of the semiconductor device of FIG. 1;
FIG. 5 is a top view of the semiconductor device of FIG. 1;
FIG. 6 is a bottom view of the semiconductor device of FIG. 1;
FIG. 7 is a top, front and right side perspective view of the semiconductor device of FIG. 1; and,
FIG. 8 is a top, rear and left side perspective view of the semiconductor device of FIG. 1.
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
Chen, Shuangching, Iso, Akira, Hyakutake, Takashi, Ogawa, Syougo, Miyashita, Syuuji
Patent |
Priority |
Assignee |
Title |
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May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Jun 17 2013 |
FUJI ELECTRIC CO , LTD |
Semiconductor module |
D721340, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
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Feb 19 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D748595, |
Feb 03 2015 |
Infineon Technologies AG |
Power semiconductor module |
D754084, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D755741, |
Feb 18 2015 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Power device package |
D755742, |
Feb 18 2015 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Power device package |
D759604, |
Jun 17 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D761746, |
Nov 04 2014 |
Sumitomo Electric Industries, Ltd. |
Semiconductor module for power conversion |
D762185, |
Aug 21 2014 |
Infineon Technologies AG |
Power semiconductor module |
D762597, |
Aug 07 2014 |
Infineon Technologies AG |
Power semiconductor module |
D766851, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D767516, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
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May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Dec 24 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
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Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D773413, |
Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Nov 28 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
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Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
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Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D776071, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
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Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
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Mitsubishi Electric Corporation |
Power semiconductor device |
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Mitsubishi Electric Corporation |
Semiconductor device |
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FUJI ELECTRIC CO., LTD |
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FUJI ELECTRIC CO., LTD |
Semiconductor module |
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Fuji Electric Co., Ltd. |
Semiconductor module |
D827593, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D847103, |
Sep 07 2017 |
ROHM CO , LTD |
Power semiconductor module |
D847104, |
Sep 29 2017 |
ROHM CO , LTD |
Power semiconductor module |
D851612, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D858467, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864132, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864882, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
D864883, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
D865690, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
D873227, |
Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D875058, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D879729, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D884662, |
Jun 01 2018 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D904991, |
Mar 15 2019 |
TAMURA CORPORATION |
Semiconductor element |
D916039, |
Mar 20 2020 |
Sansha Electric Manufacturing Co., Ltd. |
Semiconductor device |
D973030, |
Feb 23 2021 |
DONG WOON ANATECH CO., LTD |
Semiconductor device |
Patent |
Priority |
Assignee |
Title |
6521983, |
Aug 29 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device for electric power |
20010038143, |
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20110044012, |
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|
D357672, |
Sep 16 1993 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
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May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364384, |
May 23 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D432096, |
Nov 24 1999 |
Samsung Electronics Co., Ltd. |
Semiconductor module |
D441726, |
Jul 14 1999 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element |
D470825, |
Dec 28 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D476959, |
Jul 31 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
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Kabushiki Kaisha Toshiba |
Semiconductor |
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Apr 17 2006 |
Kabushiki Kaisha Toshiba |
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Fuji Electric Device Technology Co., Ltd. |
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Jun 08 2010 |
Miyoshi Electronics Corporation |
Semiconductor device |
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Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D673922, |
Apr 21 2011 |
Kioxia Corporation |
Portion of a substrate for an electronic circuit |
D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
D689446, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 01 2013 | OGAWA, SYOUGO | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030885 | /0795 |
pdf |
Jul 01 2013 | MIYASHITA, SYUUJI | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030885 | /0795 |
pdf |
Jul 02 2013 | CHEN, SHUANGCHING | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030885 | /0795 |
pdf |
Jul 02 2013 | ISO, AKIRA | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030885 | /0795 |
pdf |
Jul 03 2013 | HYAKUTAKE, TAKASHI | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030885 | /0795 |
pdf |
Jul 16 2013 | | Fuji Electric Co., Ltd. | (assignment on the face of the patent) | | / |
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