FIG. 1 is a front view of a part for semiconductor device showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view thereof;
FIG. 8 is an enlarged cross-sectional view taken along line 8-8 in FIG. 1;
FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 1; and,
FIG. 10 is an enlarged cross-sectional view of a portion labeled 10′-10′ in FIG. 1 and a portion labeled 10″-10″ in FIG. 5 taken along line 10-10 in FIG. 1.
The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.
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