Patent
   D759604
Priority
Jun 17 2015
Filed
Jun 17 2015
Issued
Jun 21 2016
Expiry
Jun 21 2031
Assg.orig
Entity
unknown
20
30
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines shown in the drawings represent portions of the semiconductor device, that form no part of the claimed design.

Kimura, Yoshitaka, Goto, Akira, Yamashita, Akihiko, Yoneyama, Rei, Araki, Takehiro, Ono, Mariko, Goto, Ryo

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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 26 2015YONEYAMA, REIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
May 26 2015ARAKI, TAKEHIROMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
May 26 2015GOTO, AKIRAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
May 26 2015YAMASHITA, AKIHIKOMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
May 26 2015ONO, MARIKOMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
May 26 2015GOTO, RYOMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
Jun 04 2015KIMURA, YOSHITAKAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0359340135 pdf
Jun 17 2015Mitsubishi Electric Corporation(assignment on the face of the patent)
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