|
The ornamental design for a semi-conductor element with terminal casing, as shown. |
|||||||||||||||||
FIG. 1 is a perspective view of the front, top and right side of a semi-conductor element with terminal casing showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.
Nagasawa, Takao, Yamada, Toshifusa, Hikita, Hiroshi, Shimizu, Tomio
| Patent | Priority | Assignee | Title |
| D399496, | Apr 16 1997 | GEC Alsthom Transport SA | Power module |
| D443248, | Oct 18 1999 | SMC Kabushiki Kaisha | Signal-input device |
| D443586, | Oct 18 1999 | SMC Kabushiki Kaisha | Signal input/output converter |
| D443587, | Oct 18 1999 | SMC Kabushiki Kaisha | Signal input device |
| D464618, | Apr 23 2001 | Kabushiki Kaisha Toshiba | Power converter |
| D593951, | Feb 05 2008 | Terminal | |
| D594419, | Feb 05 2008 | Terminal | |
| D703625, | Dec 06 2012 | SAMSUNG ELECTRO-MECHANICS CO , LTD | Power semiconductor module |
| D704670, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
| D704671, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
| D705184, | Jul 11 2013 | Fuji Electric Co., Ltd. | Semiconductor module |
| D706232, | Dec 21 2012 | Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD | Semiconductor device |
| D710317, | Jan 24 2013 | Fuji Electric Co., Inc. | Semiconductor device |
| D710318, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
| D710319, | Jan 24 2013 | Fuji Electric Co., Ltd. | Semiconductor device |
| D712853, | Dec 21 2012 | Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD | Semiconductor module |
| D714745, | Feb 14 2012 | Panasonic Corporation | Semiconductor |
| D721048, | Jun 17 2013 | FUJI ELECTRIC CO , LTD | Semiconductor module |
| D721340, | Dec 21 2012 | Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD | Semiconductor module |
| D727266, | May 31 2012 | Sick AG | Connecting module |
| D727267, | Mar 28 2013 | Sick AG | Connecting module |
| D748595, | Feb 03 2015 | Infineon Technologies AG | Power semiconductor module |
| D754084, | Aug 21 2013 | Mitsubishi Electric Corporation | Semiconductor device |
| D755741, | Feb 18 2015 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Power device package |
| D755742, | Feb 18 2015 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Power device package |
| D759604, | Jun 17 2015 | Mitsubishi Electric Corporation | Semiconductor device |
| D761746, | Nov 04 2014 | Sumitomo Electric Industries, Ltd. | Semiconductor module for power conversion |
| D762597, | Aug 07 2014 | Infineon Technologies AG | Power semiconductor module |
| D769834, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
| D785577, | Aug 21 2013 | Mitsubishi Electric Corporation | Semiconductor device |
| D790491, | Sep 30 2015 | Mitsubishi Electric Corporation | Power semiconductor device |
| D798832, | Sep 30 2015 | Mitsubishi Electric Corporation | Power semiconductor device |
| D799439, | May 31 2016 | Rohm Co., Ltd. | Power converting semiconductor module |
| D805485, | Aug 21 2013 | Mitsubishi Electric Corporation | Semiconductor device |
| D827591, | Oct 31 2016 | Fuji Electric Co., Ltd. | Semiconductor module |
| D847103, | Sep 07 2017 | ROHM CO , LTD | Power semiconductor module |
| D847104, | Sep 29 2017 | ROHM CO , LTD | Power semiconductor module |
| D858467, | Jan 05 2017 | Rohm Co., Ltd. | Power semiconductor module |
| D864132, | Jan 05 2017 | Rohm Co., Ltd. | Power semiconductor module |
| D873227, | Oct 23 2017 | Mitsubishi Electric Corporation | Semiconductor device |
| D875058, | Jan 05 2017 | Rohm Co., Ltd. | Power semiconductor module |
| D916039, | Mar 20 2020 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor device |
| Patent | Priority | Assignee | Title |
| 4252864, | Oct 10 1978 | AMP Incorporated | Lead frame having integral terminal tabs |
| 4510677, | Apr 08 1981 | Thomson CSF | Cases with flat terminal lugs for medium power semi-conductor components and a process for manufacturing same |
| 5408128, | Sep 15 1993 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Aug 25 1994 | YAMADA, TOSHIFUSA | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007161 | /0183 | |
| Aug 25 1994 | HIKITA, HIROSHI | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007161 | /0183 | |
| Aug 25 1994 | NAGASAWA, TAKAO | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007161 | /0183 | |
| Aug 25 1994 | SHIMIZU, TOMIO | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007161 | /0183 | |
| Sep 16 1994 | Fuji Electric Co., Ltd. | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |