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Patent
D721340
Priority
Dec 21 2012
Filed
Jun 21 2013
Issued
Jan 20 2015
Expiry
Jan 20 2029
Assg.orig
Entity
unknown
27
32
n/a
The ornamental design for a semiconductor module , as shown and described.
FIG. 1 is a front view of a semiconductor module showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is a cross-sectional view thereof taken along line 8 -8 of FIG. 5 .
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals protrudes from the top surface. Each end in a longitudinal direction includes a mounting hole.
Nakamura, Hideyo
Patent
Priority
Assignee
Title
D761745 ,
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D762185 ,
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D762597 ,
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D766851 ,
Feb 04 2015
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D767516 ,
Feb 04 2015
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D772182 ,
Apr 02 2014
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D772184 ,
Dec 24 2014
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D773412 ,
Feb 04 2015
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Semiconductor device
D773413 ,
Feb 04 2015
Mitsubishi Electric Corporation
Semiconductor device
D774479 ,
Nov 28 2014
Fuji Electric Co., Ltd.
Semiconductor module
D775091 ,
Aug 19 2014
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Power semiconductor module
D775593 ,
Aug 19 2014
Infineon Technologies AG
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D776071 ,
Aug 19 2014
Infineon Technologies AG
Power semiconductor module
D783550 ,
Sep 29 2014
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Power semiconductor device
D790491 ,
Sep 30 2015
Mitsubishi Electric Corporation
Power semiconductor device
D798832 ,
Sep 30 2015
Mitsubishi Electric Corporation
Power semiconductor device
D799439 ,
May 31 2016
Rohm Co., Ltd.
Power converting semiconductor module
D810036 ,
Nov 08 2016
Fuji Electric Co., Ltd.
Semiconductor module
D810706 ,
Dec 24 2014
FUJI ELECTRIC CO., LTD
Semiconductor module
D814433 ,
Nov 28 2014
FUJI ELECTRIC CO., LTD
Semiconductor module
D827591 ,
Oct 31 2016
Fuji Electric Co., Ltd.
Semiconductor module
D827593 ,
Nov 28 2014
FUJI ELECTRIC CO., LTD
Semiconductor module
D853342 ,
Feb 28 2017
Infineon Technologies AG
High-performance semiconductor module
D853978 ,
Feb 28 2017
Infineon Technologies AG
High-performance semiconductor module
D877102 ,
Dec 28 2017
Shindengen Electric Manufacturing Co., Ltd.
Semiconductor module
D906271 ,
Apr 13 2018
ROHM CO , LTD
Semiconductor module
D978809 ,
Apr 13 2018
Rohm Co., Ltd.
Semiconductor module
Patent
Priority
Assignee
Title
5408128 ,
Sep 15 1993
International Rectifier Corporation
High power semiconductor device module with low thermal resistance and simplified manufacturing
5410450 ,
Dec 10 1991
Fuji Electric Co., Ltd.
Internal wiring structure of a semiconductor device
6078501 ,
Dec 22 1997
Omnirel LLC
Power semiconductor module
6521983 ,
Aug 29 2000
Mitsubishi Denki Kabushiki Kaisha
Semiconductor device for electric power
8526199 ,
May 07 2010
Mitsubishi Electric Corporation
Semiconductor device
D364383 ,
May 11 1994
Fuji Electric Co., Ltd.
Semi-conductor element with terminal casing
D364384 ,
May 23 1994
Fuji Electric Co., Ltd.
Semi-conductor element with terminal casing
D364385 ,
May 11 1994
Fuji Electric Co., Ltd.
Semi-conductor element with terminal casing
D441726 ,
Jul 14 1999
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
Semiconductor element
D441727 ,
Oct 04 2000
Sony Corporation
Semiconductor element
D476959 ,
Jul 31 2002
Mitsubishi Denki Kabushiki Kaisha
Semiconductor device
D525215 ,
Jan 27 2004
Yamaichi Electronics Co., Ltd.
Base for a semiconductor carrier
D539761 ,
Aug 22 2006
Kabushiki Kaisha Toshiba
Semiconductor
D548202 ,
Apr 17 2006
Kabushiki Kaisha Toshiba
Semiconductor
D548203 ,
Apr 17 2006
Kabushiki Kaisha Toshiba
Semiconductor
D587662 ,
Dec 20 2007
Fuji Electric Device Technology Co., Ltd.
Semiconductor device
D589012 ,
Mar 17 2008
Fuji Electric Device Technology Co., Ltd.
Semiconductor device
D606951 ,
Nov 14 2008
Fuji Electric Device Technology Co, Ltd.
Semiconductor device
D653633 ,
Dec 14 2010
Fuji Electric Co., Ltd.
Semiconductor
D653634 ,
Oct 28 2010
Fuji Electric Co., Ltd.
Semiconductor
D674760 ,
Apr 01 2011
Fuji Electric Co., Ltd.
Semiconductor device
D686174 ,
Aug 12 2011
FUJI ELECTRIC CO., LTD
Semiconductor device
D689446 ,
Oct 28 2010
Fuji Electric Co., Ltd.
Semiconductor
D699693 ,
Oct 03 2012
FUJI ELECTRIC CO , LTD
Semiconductor device
D703625 ,
Dec 06 2012
SAMSUNG ELECTRO-MECHANICS CO , LTD
Power semiconductor module
D704670 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
D704671 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
D705184 ,
Jul 11 2013
Fuji Electric Co., Ltd.
Semiconductor module
D706232 ,
Dec 21 2012
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD
Semiconductor device
D710317 ,
Jan 24 2013
Fuji Electric Co., Inc.
Semiconductor device
D710318 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
D710319 ,
Jan 24 2013
Fuji Electric Co., Ltd.
Semiconductor device
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