Patent
   D721340
Priority
Dec 21 2012
Filed
Jun 21 2013
Issued
Jan 20 2015
Expiry
Jan 20 2029
Assg.orig
Entity
unknown
27
32
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view thereof taken along line 8-8 of FIG. 5.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals protrudes from the top surface. Each end in a longitudinal direction includes a mounting hole.

Nakamura, Hideyo

Patent Priority Assignee Title
D761745, Jun 28 2013 Sumitomo Electric Industries, Ltd. Semiconductor device
D762185, Aug 21 2014 Infineon Technologies AG Power semiconductor module
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D766851, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D767516, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D772182, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D772184, Dec 24 2014 Fuji Electric Co., Ltd. Semiconductor module
D773412, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D773413, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D774479, Nov 28 2014 Fuji Electric Co., Ltd. Semiconductor module
D775091, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D775593, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D776071, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D790491, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D798832, Sep 30 2015 Mitsubishi Electric Corporation Power semiconductor device
D799439, May 31 2016 Rohm Co., Ltd. Power converting semiconductor module
D810036, Nov 08 2016 Fuji Electric Co., Ltd. Semiconductor module
D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D814433, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D827591, Oct 31 2016 Fuji Electric Co., Ltd. Semiconductor module
D827593, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D853342, Feb 28 2017 Infineon Technologies AG High-performance semiconductor module
D853978, Feb 28 2017 Infineon Technologies AG High-performance semiconductor module
D877102, Dec 28 2017 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
D906271, Apr 13 2018 ROHM CO , LTD Semiconductor module
D978809, Apr 13 2018 Rohm Co., Ltd. Semiconductor module
Patent Priority Assignee Title
5408128, Sep 15 1993 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
5410450, Dec 10 1991 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
6078501, Dec 22 1997 Omnirel LLC Power semiconductor module
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
8526199, May 07 2010 Mitsubishi Electric Corporation Semiconductor device
D364383, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364384, May 23 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364385, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D441727, Oct 04 2000 Sony Corporation Semiconductor element
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D525215, Jan 27 2004 Yamaichi Electronics Co., Ltd. Base for a semiconductor carrier
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D689446, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D699693, Oct 03 2012 FUJI ELECTRIC CO , LTD Semiconductor device
D703625, Dec 06 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Power semiconductor module
D704670, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D706232, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor device
D710317, Jan 24 2013 Fuji Electric Co., Inc. Semiconductor device
D710318, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D710319, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 21 2013Fuji Electric Co., Ltd.(assignment on the face of the patent)
Jun 21 2013NAKAMURA, HIDEYOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0307080486 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule