Patent
   D853342
Priority
Feb 28 2017
Filed
Aug 25 2017
Issued
Jul 09 2019
Expiry
Jul 09 2034
Assg.orig
Entity
unknown
4
27
n/a
The ornamental design for a high-performance semiconductor module, as shown and described.

FIG. 1 is a top, front and right side perspective view of a high-performance semiconductor module showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front side elevational view thereof;

FIG. 4 is a right side elevational view thereof; and,

FIG. 5 is a top plan view thereof.

The broken line portions of the figure drawings are included to show portions of the article that form no part of the claimed design.

All surfaces not shown form no part of the claimed design.

Auer, Thomas, Bertalan, Andras, Krugmann, Jens, Messelke, Christoph

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 25 2017Infineon Technologies AG(assignment on the face of the patent)
Aug 28 2017BERTALAN, ANDRASInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0437630143 pdf
Aug 28 2017KRUGMANN, JENSInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0437630143 pdf
Aug 28 2017MESSELKE, CHRISTOPHInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0437630143 pdf
Sep 21 2017AUER, THOMASInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0437630143 pdf
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