Patent
   D648290
Priority
Jun 08 2010
Filed
Dec 07 2010
Issued
Nov 08 2011
Expiry
Nov 08 2025
Assg.orig
Entity
unknown
33
11
n/a
The ornamental design for a semiconductor device, as shown.

FIG. 1 is a front view of a semiconductor device of a first embodiment showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof,

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a view showing front, left side and top plan thereof;

FIG. 8 is a view showing front, right side and bottom plan thereof;

FIG. 9 is a front view of a semiconductor device of a second embodiment showing my new design;

FIG. 10 is a rear view thereof;

FIG. 11 is a top plan view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is a left side view thereof;

FIG. 15 is a view showing front, left side and top plan thereof; and,

FIG. 16 is a view showing front, right side and bottom plan thereof.

Mori, Kazuhito

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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 10 2010MORI, KAZUHITOMiyoshi Electronics CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0254640019 pdf
Dec 07 2010Miyoshi Electronics Corporation(assignment on the face of the patent)
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