FIG. 1 is a front view of a semiconductor device of a first embodiment showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof,
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a view showing front, left side and top plan thereof;
FIG. 8 is a view showing front, right side and bottom plan thereof;
FIG. 9 is a front view of a semiconductor device of a second embodiment showing my new design;
FIG. 10 is a rear view thereof;
FIG. 11 is a top plan view thereof;
FIG. 12 is a bottom plan view thereof;
FIG. 13 is a right side view thereof;
FIG. 14 is a left side view thereof;
FIG. 15 is a view showing front, left side and top plan thereof; and,
FIG. 16 is a view showing front, right side and bottom plan thereof.
Patent |
Priority |
Assignee |
Title |
D675582, |
Jun 27 2011 |
UI TECHNOLOGIES, INC |
Chip assembly |
D703625, |
Dec 06 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Power semiconductor module |
D704670, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D704671, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D710317, |
Jan 24 2013 |
Fuji Electric Co., Inc. |
Semiconductor device |
D710318, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D710319, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D762185, |
Aug 21 2014 |
Infineon Technologies AG |
Power semiconductor module |
D762597, |
Aug 07 2014 |
Infineon Technologies AG |
Power semiconductor module |
D775091, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D775593, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D776071, |
Aug 19 2014 |
Infineon Technologies AG |
Power semiconductor module |
D796459, |
Apr 11 2016 |
Rohm Co., Ltd. |
Packaged semiconductor circuit module |
D813182, |
Aug 02 2016 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Semiconductor device |
D822627, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D822628, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D822629, |
Jan 26 2017 |
Kyocera Corporation |
Semiconductor package |
D823270, |
Sep 30 2016 |
Rohm Co., Ltd. |
Semiconductor device |
D827591, |
Oct 31 2016 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D832227, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
D832228, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
D851612, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D853342, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D853978, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D879729, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D893439, |
May 07 2018 |
ADURA, LLC |
Circuit board having arrangements of light-emitting diodes |
D900759, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D902164, |
Jan 24 2019 |
Kioxia Corporation |
Integrated circuit card |
D906273, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D933618, |
Oct 31 2018 |
Asahi Kasei Microdevices Corporation |
Semiconductor module |
D934821, |
Jul 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
D973030, |
Feb 23 2021 |
DONG WOON ANATECH CO., LTD |
Semiconductor device |