Patent
   D444132
Priority
Aug 23 2000
Filed
Aug 23 2000
Issued
Jun 26 2001
Expiry
Jun 26 2015
Assg.orig
Entity
unknown
44
6
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a semiconductor element showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof; a left side view being a mirror image thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a front, bottom and right side perspective view of a second embodiment of the semiconductor element;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a rear elevational view thereof; and,

FIG. 12 is a bottom plan view thereof.

Suzuki, Kenji, Inoue, Toshihisa, Kurahashi, Kazuhiko, Yano, Shinjiro, Iwanishi, Masaaki

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Patent Priority Assignee Title
D345731, Dec 03 1992 Freescale Semiconductor, Inc Semiconductor package
D359028, Sep 02 1993 SGS-Thomson Microelectronics, Inc Socketed integrated circuit package
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D427977, Jun 18 1999 FUKIJURA LTD Piezoelectric conversion type semiconductor device
D432097, Nov 20 1999 Samsung Electronics Co., Ltd. Semiconductor package
JP1004664,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 23 2000Kabushiki Kaisha Toshiba(assignment on the face of the patent)
Aug 28 2000KURAHASHI, KAZUHIKOKabushiki Kaisha Toshiba ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 03490114210190 pdf
Aug 28 2000SUZUKI, KENJIKabushiki Kaisha Toshiba ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 03490114210190 pdf
Aug 28 2000SUZUKI, KENJIKabushiki Kaisha ToshibaINVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 0113070349 pdf
Aug 28 2000KURAHASHI, KAZUHIKOKabushiki Kaisha ToshibaINVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 0113070349 pdf
Sep 18 2000INOUE, TOSHIHISAKabushiki Kaisha ToshibaINVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 0113070349 pdf
Sep 18 2000INOUE, TOSHIHISAKabushiki Kaisha Toshiba ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 03490114210190 pdf
Sep 25 2000IWANISHI, MASAAKIKabushiki Kaisha Toshiba ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 03490114210190 pdf
Sep 25 2000IWANISHI, MASAAKIKabushiki Kaisha ToshibaINVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 0113070349 pdf
Oct 04 2000YANO, SHINJIROKabushiki Kaisha Toshiba ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 03490114210190 pdf
Oct 04 2000YANO, SHINJIROKabushiki Kaisha ToshibaINVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 0113070349 pdf
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