|
The ornamental design for a semiconductor element, as shown and described. |
FIG. 1 is a front, bottom and right side perspective view of a semiconductor element showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof; a left side view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a front, bottom and right side perspective view of a second embodiment of the semiconductor element;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a rear elevational view thereof; and,
FIG. 12 is a bottom plan view thereof.
Suzuki, Kenji, Inoue, Toshihisa, Kurahashi, Kazuhiko, Yano, Shinjiro, Iwanishi, Masaaki
Patent | Priority | Assignee | Title |
8975694, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device |
9269661, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device |
9497570, | Feb 06 2014 | NIMBELINK CORP | Embedded wireless modem |
D466873, | Oct 31 2001 | Siliconix Incorporated | Semiconductor chip package |
D472528, | Oct 31 2001 | Siliconix Incorporated | Semiconductor chip package |
D475028, | Mar 11 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
D475355, | Mar 11 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
D475982, | Mar 11 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
D476962, | Mar 29 2002 | Kabushiki Kaisha Toshiba | Semiconductor device |
D504874, | Aug 11 2004 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Semiconductor device package |
D508682, | Feb 23 2004 | Kabushiki Kaisha Toshiba | Semiconductor device |
D510728, | Aug 11 2004 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | Semiconductor device package |
D514074, | Aug 27 2003 | Kabushiki Kaisha Toshiba | Semiconductor device |
D520466, | Oct 01 2003 | Kabushiki Kaisha Toshiba | Rectifier element diode |
D521952, | Feb 23 2004 | Kabushiki Kaisha Toshiba | Semiconductor device |
D522978, | Jun 25 2004 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Information storage semiconductor element |
D525214, | Jun 25 2004 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Information storage semiconductor element |
D531140, | Nov 14 2005 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
D648290, | Jun 08 2010 | Miyoshi Electronics Corporation | Semiconductor device |
D668658, | Nov 15 2011 | connectBlue AB | Module |
D668659, | Nov 15 2011 | connectBlue AB | Module |
D680119, | Nov 15 2011 | connectBlue AB | Module |
D680545, | Nov 15 2011 | connectBlue AB | Module |
D689053, | Nov 15 2011 | connectBlue AB | Module |
D692896, | Nov 15 2011 | connectBlue AB | Module |
D721047, | Mar 07 2013 | Vicor Corporation | Semiconductor device |
D731491, | Feb 07 2014 | NIMBELINK CORP | Embedded cellular modem |
D732487, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D732488, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D752000, | Mar 07 2013 | Vicor Corporation | Semiconductor device |
D758329, | Aug 06 2013 | EPISTAR CORPORATION | Partial semiconductor light emitting component |
D760230, | Sep 16 2014 | Daishinku Corporation | Piezoelectric vibration device |
D767571, | Sep 16 2014 | Daishinku Corporation | Piezoelectric vibration device |
D796459, | Apr 11 2016 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
D822629, | Jan 26 2017 | Kyocera Corporation | Semiconductor package |
D832227, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
D832228, | Nov 15 2016 | Rohm Co., Ltd. | Semiconductor module |
D845921, | May 02 2017 | Rohm Co., Ltd. | Semiconductor device |
D902877, | Jun 12 2018 | Rohm Co., Ltd. | Packaged semiconductor module |
D904325, | Mar 20 2019 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
D934187, | Jan 21 2020 | GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD | Integrated circuit package |
D937231, | Apr 06 2020 | WOLFSPEED, INC | Power semiconductor package |
D945384, | Sep 26 2019 | LAPIS SEMICONDUCTOR CO , LTD | Semiconductor module |
D969762, | Apr 06 2020 | WOLFSPEED, INC. | Power semiconductor package |
Patent | Priority | Assignee | Title |
D345731, | Dec 03 1992 | Freescale Semiconductor, Inc | Semiconductor package |
D359028, | Sep 02 1993 | SGS-Thomson Microelectronics, Inc | Socketed integrated circuit package |
D396847, | Oct 17 1996 | Panasonic Corporation | Semiconductor device |
D427977, | Jun 18 1999 | FUKIJURA LTD | Piezoelectric conversion type semiconductor device |
D432097, | Nov 20 1999 | Samsung Electronics Co., Ltd. | Semiconductor package |
JP1004664, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 23 2000 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / | |||
Aug 28 2000 | KURAHASHI, KAZUHIKO | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 0349 | 011421 | /0190 | |
Aug 28 2000 | SUZUKI, KENJI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 0349 | 011421 | /0190 | |
Aug 28 2000 | SUZUKI, KENJI | Kabushiki Kaisha Toshiba | INVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 | 011307 | /0349 | |
Aug 28 2000 | KURAHASHI, KAZUHIKO | Kabushiki Kaisha Toshiba | INVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 | 011307 | /0349 | |
Sep 18 2000 | INOUE, TOSHIHISA | Kabushiki Kaisha Toshiba | INVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 | 011307 | /0349 | |
Sep 18 2000 | INOUE, TOSHIHISA | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 0349 | 011421 | /0190 | |
Sep 25 2000 | IWANISHI, MASAAKI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 0349 | 011421 | /0190 | |
Sep 25 2000 | IWANISHI, MASAAKI | Kabushiki Kaisha Toshiba | INVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 | 011307 | /0349 | |
Oct 04 2000 | YANO, SHINJIRO | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNOR S INTEREST RE-RECORD TO CORRECT THE RECORDATION DATE OF 11-28-00 TO 11-8-00 PREVIOUSLY RECORDED AT REEL FRAME 11307 0349 | 011421 | /0190 | |
Oct 04 2000 | YANO, SHINJIRO | Kabushiki Kaisha Toshiba | INVALID RECORDING, DOCUMENT RE-RECORDED TO CORRECT THE RECORDATION DATE SEE DOCUMENT AT REEL 11421, FRAME 0190 | 011307 | /0349 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |