Patent
   D692896
Priority
Nov 15 2011
Filed
Nov 15 2011
Issued
Nov 05 2013
Expiry
Nov 05 2027

TERM.DISCL.
Assg.orig
Entity
unknown
1
242
n/a
I claim the ornamental design for a module, as shown and described.

FIG. 1 is a top view of my new design for a module;

FIG. 2 is a partial perspective view thereof.

FIG. 3 is a right side view thereof, the left side view being a mirror image thereof; and,

FIG. 4 is a front view thereof, the rear view being a mirror image thereof.

Nilsson, Rolf

Patent Priority Assignee Title
D845921, May 02 2017 Rohm Co., Ltd. Semiconductor device
Patent Priority Assignee Title
2706742,
3185947,
3357099,
3398232,
3747210,
3760091,
3887783,
3964087, May 15 1975 Burroughs Corporation Resistor network for integrated circuit
4029531, Mar 29 1976 RCA Corporation Method of forming grooves in the [011] crystalline direction
4074340, Oct 18 1976 Vitramon, Incorporated Trimmable monolithic capacitors
4223321, Apr 30 1979 EASTMAN KODAK COMPANY A NJ CORP Planar-faced electrode for ink jet printer and method of manufacture
4288840, Sep 26 1978 Matsushita Electric Industrial Co., Ltd. Printed circuit board
4312026, Apr 11 1979 TDK CORPORATION 13-1 NIHOMBASHI 1-CHOME, CHUO-KU, TOKYO Chip ceramic capacitor
4313157, Sep 26 1978 Draloric Electronic GmbH Capacitive network
4400762, Aug 25 1980 Allen-Bradley Company Edge termination for an electrical circuit device
4419714, Apr 02 1982 International Business Machines Corporation Low inductance ceramic capacitor and method for its making
4430690, Oct 07 1982 International Business Machines Corporation Low inductance MLC capacitor with metal impregnation and solder bar contact
4437141, Sep 14 1981 Texas Instruments Incorporated High terminal count integrated circuit device package
4522449, Dec 27 1977 Matrix board
4551746, Oct 05 1982 Mayo Foundation for Medical Education and Research Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
4616655, Jan 20 1984 Pacesetter, Inc Implantable pulse generator having a single printed circuit board and a chip carrier
4627533, Oct 29 1984 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
4630171, Nov 22 1983 Interconnexions Ceramiques SA Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members
4661884, Mar 10 1986 American Technical Ceramics Corp. Miniature, multiple layer, side mounting high frequency blocking capacitor
4750246, Oct 29 1984 Hughes Aircraft Company Method of making compensated crystal oscillator
4775917, Dec 03 1985 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
4790894, Feb 19 1987 Howmet Research Corporation Process for producing printed wiring board
4821007, Feb 06 1987 ANAREN MICROWAVE, INC Strip line circuit component and method of manufacture
4842184, Jun 23 1988 Lockheed Martin Corp Method and apparatus for applying solder preforms
4852227, Nov 25 1988 MRA Laboratories, Inc Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge
4853826, Aug 01 1988 Circuit Components, Incorporated Low inductance decoupling capacitor
4947286, Aug 11 1988 Murata Manufacturing Co., Ltd. Multilayer capacitor device
4956694, Nov 04 1988 TWILIGHT TECHNOLOGY, INC Integrated circuit chip stacking
4963843, Oct 31 1988 CTS Corporation Stripline filter with combline resonators
4978639, Jan 10 1989 AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
5092035, Sep 10 1990 Motorola, Inc Method of making printed circuit board assembly
5126286, Oct 05 1990 Round Rock Research, LLC Method of manufacturing edge connected semiconductor die
5138115, Oct 12 1990 Atmel Corporation Carrierles surface mounted integrated circuit die
5140745, Jul 23 1990 Method for forming traces on side edges of printed circuit boards and devices formed thereby
5206495, Oct 24 1989 CLM COMBICARD LICENSE MARKETING GMBH; CLM COMBICARD LICENSE MARKETING GMBH+CO KG Chip card
5224021, Oct 20 1989 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Surface-mount network device
5225969, Dec 15 1989 TDK Corporation Multilayer hybrid circuit
5239198, Sep 06 1989 Freescale Semiconductor, Inc Overmolded semiconductor device having solder ball and edge lead connective structure
5247423, May 26 1992 Freescale Semiconductor, Inc Stacking three dimensional leadless multi-chip module and method for making the same
5266833, Mar 30 1992 Integrated circuit bus structure
5293067, May 23 1991 Freescale Semiconductor, Inc Integrated circuit chip carrier
5309326, Dec 06 1991 Rohm Co., Ltd. Circuit module having stacked circuit boards
5313096, Mar 16 1992 STAKTEK GROUP L P IC chip package having chip attached to and wire bonded within an overlying substrate
5367430, Oct 21 1992 PRESIDIO COMPONENTS INC Monolithic multiple capacitor
5376778, Feb 26 1992 Angewandte Digital Electronik GmbH Contact-free chip card for remote transmission
5383095, Oct 29 1993 The Whitaker Corporation; WHITAKER CORPORATION, THE Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge
5386087, Feb 17 1992 Berg Technology, Inc Printed circuit board having U-shaped solder mask layer separating respective contacts
5428885, Jan 14 1989 TDK Corporation Method of making a multilayer hybrid circuit
5434745, Jul 26 1994 White Microelectronics Div. of Bowmar Instrument Corp. Stacked silicon die carrier assembly
5471368, Nov 16 1993 International Business Machines Corporation Module having vertical peripheral edge connection
5488765, Jul 27 1992 Murata Manufacturing Co., Ltd. Method of measuring characteristics of a multilayer electronic component
5493769, Aug 05 1993 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component and measuring characteristics of same
5502885, Feb 25 1992 Rohm Co., Ltd. Method of manfacturing a chip-type composite electronic part
5514907, Mar 21 1995 Simple Technology Incorporated Apparatus for stacking semiconductor chips
5570505, Nov 16 1993 International Business Machines Corporation Method of manufacturing a circuit module
5599413, Nov 25 1992 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Method of producing a ceramic electronic device
5600101, Jul 21 1994 MURATA MANUFACTURING CO , LTD Multilayer electronic component and method of manufacturing the same
5604328, Jul 27 1992 Murata Manufacturing Co., Ltd. Multilayer electronic component
5621619, Oct 25 1990 CTS Corporation All ceramic surface mount sip and dip networks having spacers and solder barriers
5625935, Jul 27 1992 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
5635669, Jul 27 1992 Murata Manufacturing Co., Ltd. Multilayer electronic component
5635670, Jul 27 1992 Murata Manufacturing Co., Ltd. Multilayer electronic component
5644107, Jul 27 1992 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
5661420, Mar 08 1995 TETRA LAVAL HOLDINGS & FINANCE S A ; ETYMOTIC RESEARCH, INC Mounting configuration for monolithic integrated circuit
5714239, Mar 15 1993 Murata Manufacturing Co., Ltd. Composite component
5729437, Jun 22 1994 Seiko Epson Corporation Electronic part including a thin body of molding resin
5731709, Jan 26 1996 SHENZHEN XINGUODU TECHNOLOGY CO , LTD Method for testing a ball grid array semiconductor device and a device for such testing
5740010, Oct 21 1992 Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors
5752182, May 09 1994 Matsushita Electric Industrial Co., Ltd. Hybrid IC
5773812, Feb 08 1994 Angewandte Digital Elektronik GmbH Chip card capable of both contact and contactless operation including a contact block
5811799, Jul 31 1997 Harvatek Corporation Image sensor package having a wall with a sealed cover
5832600, Jun 06 1995 Seiko Epson Corporation Method of mounting electronic parts
5841217, Mar 14 1996 CITIZEN HOLDINGS CO , LTD Surface mounting crystal unit
5847930, Oct 13 1995 HEI, Inc. Edge terminals for electronic circuit modules
5854534, Aug 05 1992 Fujitsu Limited Controlled impedence interposer substrate
5877561, Dec 29 1995 MAGNACHIP SEMICONDUCTOR LTD Plate and column type semiconductor package having heat sink
5917709, Jun 16 1997 Eastman Kodak Company Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
5949294, Sep 20 1996 JVC Kenwood Corporation Reference frequency source oscillator formed from first and second containers
5966052, Apr 09 1997 Murata Manufacturing Co., Ltd. Voltage-controlled oscillator with input and output on opposite corners of substrate
5979048, Jun 21 1995 POLYPLASTICS, CO , INC ; SANKYOUKASEI CO , LTD Method of manufacturing connectors
5991162, Jun 27 1997 Renesas Electronics Corporation High-frequency integrated circuit device and manufacture method thereof
6046409, Feb 26 1997 NGK SPARK PLUG CO , LTD Multilayer microelectronic circuit
6057597, Dec 15 1997 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor package with pre-fabricated cover
6058004, Sep 08 1997 KNOWLES CAPITAL FORMATION, INC Unitized discrete electronic component arrays
6084780, Feb 06 1996 Kabushiki Kaisha Toshiba Printed circuit board with high electronic component density
6115262, Jun 08 1998 Visteon Global Technologies, Inc Enhanced mounting pads for printed circuit boards
6144090, Feb 13 1997 Fujitsu Limited Ball grid array package having electrodes on peripheral side surfaces of a package board
6147876, Sep 14 1993 Kabushiki Kaisha Toshiba Multi-chip module having printed wiring board comprising circuit pattern for IC chip
6181560, Jul 28 1995 MAGNACHIP SEMICONDUCTOR LTD Semiconductor package substrate and semiconductor package
6218628, May 18 1994 Dyconex Patente AG Foil circuit boards and semifinished products and method for the manufacture thereof
6278178, Feb 10 1998 HYUNDAI ELECTRONICS INDUSTRIES CO , LTD Integrated device package and fabrication methods thereof
6287949, Jun 20 1994 SOCIONEXT INC Multi-chip semiconductor chip module
6288345, Mar 22 2000 OL SECURITY LIMITED LIABILITY COMPANY Compact z-axis DC and control signals routing substrate
6378757, Jan 31 2001 Agilent Technologies, Inc Method for edge mounting flex media to a rigid PC board
6383835, Sep 01 1995 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
6388264, Mar 28 1997 Data Device Corporation Optocoupler package being hermetically sealed
6407904, May 10 1999 MURATA MANUFACTURING CO , LTD Multi-layer capacitor
6407906, Dec 06 1999 TDK Corporation Multiterminal-multilayer ceramic capacitor
6418030, Sep 14 1993 Kabushiki Kaisha Toshiba Multi-chip module
6452112, Oct 19 1998 ALPS Electric Co., Ltd. Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same
6456168, Dec 29 2000 CTS CORPORATION, A CORP OF INDIANA Temperature compensated crystal oscillator assembled on crystal base
6462408, Mar 27 2001 TAMIRAS PER PTE LTD , LLC Contact member stacking system and method
6496355, Oct 04 2001 AVX Corporation Interdigitated capacitor with ball grid array (BGA) terminations
6528870, Jan 28 2000 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of stacked wiring boards
6534726, Oct 25 1999 MURATA MANUFACTURING CO , LTD Module substrate and method of producing the same
6566611, Sep 26 2001 Intel Corporation Anti-tombstoning structures and methods of manufacture
6576999, Jul 06 2000 Murata Manufacturing Co., Ltd. Mounting structure for an electronic component having an external terminal electrode
6583981, Nov 29 2000 Murata Manufacturing Co., Ltd. Ceramic condenser module
6601295, Mar 03 1999 Method of producing chip-type electronic devices
6601296, Jul 06 1999 THE BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT Multi-shot injection molding process for making electrical connectors and three-dimensional circuits
6606237, Jun 27 2002 Murata Manufacturing Co., Ltd.; Intel Corporation Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
6624505, Feb 06 1998 Invensas Corporation Packaged integrated circuits and methods of producing thereof
6639311, Oct 05 2001 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
6657848, Jan 28 2000 TDK Corporation Multilayer electronic device and method for producing same
6665930, Mar 04 1998 Koninklijke Philips Electronics N V Printed circuit board with SMD components
6670700, Aug 19 1999 Seiko Epson Corporation Interconnect substrate and semiconductor device electronic instrument
6700794, Jul 26 2001 Harris Corporation Decoupling capacitor closely coupled with integrated circuit
6713868, Nov 30 2001 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
6714420, May 30 2000 ALPS ELECTRIC CO , LTD Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment
6724083, Jul 16 2001 ARS Electronics Co., Ltd. Method of producing semiconductor packages by cutting via holes into half when separating substrate
6727116, Jun 27 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
6751101, Nov 02 2000 Murata Manufacturing Co., Ltd. Electronic component and method of producing the same
6759940, Jan 10 2002 ACF FINCO I LP Temperature compensating device with integral sheet thermistors
6760227, Nov 02 2000 Murata Manufacturing Co., Ltd.; MURATA MANUFACTURING CO , LTD Multilayer ceramic electronic component and manufacturing method thereof
6795294, Jan 31 2003 Murata Manufacturing Co., Ltd. Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit
6803251, Feb 10 1998 Hyundai Electronics Industries Co., Ltd. Integrated device package and fabrication methods thereof
6818977, Jul 17 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages
6822321, Sep 30 2002 Macom Technology Solutions Holdings, Inc Packaged RF power transistor having RF bypassing/output matching network
6828656, Feb 08 2001 Micron Technology, Inc. High performance silicon contact for flip chip and a system using same
6855572, Aug 28 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Castellation wafer level packaging of integrated circuit chips
6862190, Jan 17 2001 Honeywell International, Inc. Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
6906907, Apr 15 2003 Kemet Electronics Corporation Monolithic multi-layer capacitor with improved lead-out structure
6929974, Oct 18 2002 Continental Automotive Systems, Inc Feedthrough design and method for a hermetically sealed microdevice
6933209, Dec 24 2003 SUPER TALENT TECHNOLOGY, CORP Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges
6934145, Jul 06 2000 PHYCOMP HOLDING B V Ceramic multilayer capacitor array
6949819, Dec 27 2001 ALPS Electric Co., Ltd. Jumper chip component and mounting structure therefor
6956252, Apr 24 2002 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
6960366, Apr 15 2002 KYOCERA AVX Components Corporation Plated terminations
6987315, Nov 25 2002 Samsung Electro-Mechanics Co., Ltd. Ceramic multilayer substrate
6998926, Dec 17 2002 Seiko Epson Corporation Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator
7024947, Mar 07 2002 ALPS Electric Co., Ltd. Detection device including circuit component
7041527, Jul 29 1997 Harvatek Corporation Charge coupled device package
7045386, Feb 03 1999 Rohm Co., Ltd. Semiconductor device and semiconductor chip for use therein
7050288, Mar 11 2004 TDK Corporation Laminated ceramic capacitor
7067172, Apr 15 2002 KYOCERA AVX Components Corporation Component formation via plating technology
7068490, Apr 16 2004 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
7098081, Sep 27 2001 HAMAMATSU PHOTONICS K K Semiconductor device and method of manufacturing the device
7098531, Dec 27 2001 ALPS Electric Co., Ltd. Jumper chip component and mounting structure therefor
7123108, Aug 26 2004 Nihon Dempa Kogyo Co., Ltd. Surface mount crystal oscillator
7126226, Feb 03 1999 Taiwan Semiconductor Manufacturing Company, Ltd Semiconductor device and semiconductor chip for use therein
7151310, Sep 25 2001 SNAPTRACK, INC Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
7152291, Apr 15 2002 KYOCERA AVX Components Corporation Method for forming plated terminations
7168161, Aug 25 2003 Renesas Electronics Corporation Manufacturing method of solid-state image sensing device
7177137, Apr 15 2002 KYOCERA AVX Components Corporation Plated terminations
7189083, Apr 01 2002 INTERPLEX INDUSTRIES, INC Method of retaining a solder mass on an article
7212395, Dec 28 2004 Intel Corporation Capacitor design for controlling equivalent series resistance
7226809, Jun 18 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
7232318, Nov 22 2005 Lih Duo International Co., Ltd. IC embedding seat
7247509, Sep 03 2003 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Method for manufacturing solid-state imaging devices
7273765, Apr 28 2003 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Solid-state imaging device and method for producing the same
7285850, Jun 18 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Support elements for semiconductor devices with peripherally located bond pads
7291235, Apr 16 2004 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
7304377, Sep 25 2001 SNAPTRACK, INC Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
7335951, Oct 06 2003 SEMICONDUCTOR ENERGY LABORATORY CO , LTD Semiconductor device and method for manufacturing the same
7411776, Jul 12 2006 TDK Corporation Multilayer capacitor array
7420262, Feb 27 2003 Infineon Technologies AG Electronic component and semiconductor wafer, and method for producing the same
7429501, Aug 25 2003 XILINX, Inc. Lid and method of employing a lid on an integrated circuit
7433172, Mar 10 2005 TDK Corporation Multilayer capacitor
7466535, Nov 22 2005 Murata Manufacturing Co., Ltd. Multilayer capacitor
7502216, Aug 06 2007 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
7506438, Nov 14 2000 SHENZHEN XINGUODU TECHNOLOGY CO , LTD Low profile integrated module interconnects and method of fabrication
7508647, Nov 22 2005 Murata Manufacturing Co., Ltd. Multilayer capacitor
7554189, Mar 03 2008 UNIVERSAL SCIENTIFIC INDUSTRIAL SHANGHAI CO , LTD Wireless communication module
7576968, Apr 15 2002 KYOCERA AVX Components Corporation Plated terminations and method of forming using electrolytic plating
7599166, Nov 17 2005 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
7612443, Sep 04 2003 University of Notre Dame du Lac Inter-chip communication
7616427, May 22 2006 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor
7750441, Jun 29 2006 Intel Corporation Conductive interconnects along the edge of a microelectronic device
7791173, Jan 23 2007 Samsung Electronics Co., Ltd. Chip having side pad, method of fabricating the same and package using the same
7820484, Jun 14 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Wafer level packaging
7829977, Nov 15 2007 Advanced Semiconductor Engineering, Inc. Low temperature co-fired ceramics substrate and semiconductor package
7843115, Nov 25 2003 ETA SA Manufacture Horlogere Suisse Electronic component having a resonator element arranged in an hermetically closed housing and method for manufacturing such an electronic component
7888185, Aug 17 2006 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
7932786, Nov 30 2005 Nihon Dempa Kogyo Co., Ltd. Surface mount type crystal oscillator
8021965, Sep 04 2003 University of Notre Dame du Lac Inter-chip communication
8065792, May 06 2003 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Method for packaging circuits
8106488, Jun 14 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Wafer level packaging
8113888, May 15 2008 CommScope EMEA Limited; CommScope Technologies LLC Circuit board for electrical connector and electrical connector
8138617, Oct 08 2001 Round Rock Research, LLC Apparatus and method for packaging circuits
8159813, Apr 01 2008 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network
20010055191,
20020029904,
20020116668,
20020123213,
20020171997,
20030071341,
20030117784,
20030232462,
20040157410,
20040207049,
20040218344,
20050130345,
20070205017,
20080211113,
20100146780,
204910,
205912,
205913,
218747,
221282,
240631,
D254687, Jan 25 1979 McDonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
D267094, Apr 12 1979 Sharp Corporation Magnetic card for microwave oven
D299139, Dec 04 1985 Interlego Interface panel
D350125, Apr 24 1992 KREI, SENTO Data containing rocket card
D416236, Sep 02 1998 SII CRYSTAL TECHNOLOGY INC Integrated circuit package
D429704, Mar 10 1999 Printed circuit board for wireless telephones
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
D453734, Jun 30 2000 Molex Incorporated Board to board receptacle connector
D455125, Jun 30 2000 Molex Incorporated Board to board plug connector
D466093, Apr 27 2001 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybird integrated circuit board
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D474773, Jul 10 2001 Sony Corporation Information recording element
D476962, Mar 29 2002 Kabushiki Kaisha Toshiba Semiconductor device
D493152, Nov 27 2002 LENOVO INTERNATIONAL LIMITED Server blade chassis midplane printed circuit board with cover
D499379, Aug 08 2003 Hon Hai Precision Ind. Co., Ltd. Electrical connector
D501448, Aug 19 2003 Japan Aviation Electronics Industry, Limited Electrical connector
D508235, Dec 05 2003 Nichia Corporation Light emitting diode
D508682, Feb 23 2004 Kabushiki Kaisha Toshiba Semiconductor device
D521952, Feb 23 2004 Kabushiki Kaisha Toshiba Semiconductor device
D536309, Dec 08 2004 Nichia Corporation Light emitting diode board
D544447, Sep 26 2006 Cheng Uei Precision Industry Co., Ltd. Board to board connector
D582852, May 31 2007 Omron Corporation Plug
D582858, May 31 2007 Omron Corporation Socket
D605613, May 15 2008 CommScope EMEA Limited; CommScope Technologies LLC Printed circuit board for electrical connector
D616373, Jul 24 2007 Omron Corporation Connector for flexible printed circuit board
D643040, Oct 26 2010 Hon Hai Precision Ind. Co., Ltd. Electrical card
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 15 2011connectBlue AB(assignment on the face of the patent)
Jan 05 2012ROLF NILSSONconnectBlue ABASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0275500475 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule