Patent
   D508682
Priority
Feb 23 2004
Filed
May 27 2004
Issued
Aug 23 2005
Expiry
Aug 23 2019
Assg.orig
Entity
unknown
18
13
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a top plan view thereof; the opposite side being a mirror image thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof; the opposite side being a mirror image thereof; and,

FIG. 5 is a rear elevational view thereof.

Yamada, Tatsuya, Inoue, Toshihisa, Tomioka, Taizo, Usuda, Osamu, Shimokawa, Kazuo, Endo, Yoshiki, Urase, Masahiro, Kurahashi, Kazuhiko

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Executed onAssignorAssigneeConveyanceFrameReelDoc
May 27 2004Kabushiki Kaisha Toshiba(assignment on the face of the patent)
Aug 06 2004YAMADA, TATSUYAKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004KURAHASHI, KAZUHIKOKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004INOUE, TOSHIHISAKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004TOMIOKA, TAIZOKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004SHIMOKAWA, KAZUOKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004ENDO, YOSHIKIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004URASE, MASAHIROKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
Aug 06 2004USUDA, OSAMUKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0157340751 pdf
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