Patent |
Priority |
Assignee |
Title |
2706742, |
|
|
|
3185947, |
|
|
|
3357099, |
|
|
|
3398232, |
|
|
|
3747210, |
|
|
|
3760091, |
|
|
|
3887783, |
|
|
|
3964087, |
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Resistor network for integrated circuit |
4029531, |
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4074340, |
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4288840, |
Sep 26 1978 |
Matsushita Electric Industrial Co., Ltd. |
Printed circuit board |
4312026, |
Apr 11 1979 |
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4313157, |
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International Business Machines Corporation |
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Sep 14 1981 |
Texas Instruments Incorporated |
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Dec 27 1977 |
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Dec 15 1989 |
TDK Corporation |
Multilayer hybrid circuit |
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May 26 1992 |
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5266833, |
Mar 30 1992 |
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Mar 16 1992 |
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IC chip package having chip attached to and wire bonded within an overlying substrate |
5367430, |
Oct 21 1992 |
PRESIDIO COMPONENTS INC |
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5376778, |
Feb 26 1992 |
Angewandte Digital Electronik GmbH |
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Berg Technology, Inc |
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TDK Corporation |
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5434745, |
Jul 26 1994 |
White Microelectronics Div. of Bowmar Instrument Corp. |
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5471368, |
Nov 16 1993 |
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Murata Manufacturing Co., Ltd. |
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Murata Manufacturing Co., Ltd. |
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Mar 21 1995 |
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Nov 16 1993 |
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Multilayer electronic component |
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Oct 25 1990 |
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All ceramic surface mount sip and dip networks having spacers and solder barriers |
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Murata Manufacturing Co., Ltd. |
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Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Multilayer electronic component |
5635670, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Multilayer electronic component |
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Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Method of manufacturing a multilayer electronic component |
5661420, |
Mar 08 1995 |
TETRA LAVAL HOLDINGS & FINANCE S A ; ETYMOTIC RESEARCH, INC |
Mounting configuration for monolithic integrated circuit |
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Mar 15 1993 |
Murata Manufacturing Co., Ltd. |
Composite component |
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Jun 22 1994 |
Seiko Epson Corporation |
Electronic part including a thin body of molding resin |
5731709, |
Jan 26 1996 |
SHENZHEN XINGUODU TECHNOLOGY CO , LTD |
Method for testing a ball grid array semiconductor device and a device for such testing |
5740010, |
Oct 21 1992 |
|
Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors |
5752182, |
May 09 1994 |
Matsushita Electric Industrial Co., Ltd. |
Hybrid IC |
5773812, |
Feb 08 1994 |
Angewandte Digital Elektronik GmbH |
Chip card capable of both contact and contactless operation including a contact block |
5811799, |
Jul 31 1997 |
Harvatek Corporation |
Image sensor package having a wall with a sealed cover |
5832600, |
Jun 06 1995 |
Seiko Epson Corporation |
Method of mounting electronic parts |
5841217, |
Mar 14 1996 |
CITIZEN HOLDINGS CO , LTD |
Surface mounting crystal unit |
5847930, |
Oct 13 1995 |
HEI, Inc. |
Edge terminals for electronic circuit modules |
5854534, |
Aug 05 1992 |
Fujitsu Limited |
Controlled impedence interposer substrate |
5877561, |
Dec 29 1995 |
MAGNACHIP SEMICONDUCTOR LTD |
Plate and column type semiconductor package having heat sink |
5917709, |
Jun 16 1997 |
Eastman Kodak Company |
Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
5949294, |
Sep 20 1996 |
JVC Kenwood Corporation |
Reference frequency source oscillator formed from first and second containers |
5966052, |
Apr 09 1997 |
Murata Manufacturing Co., Ltd. |
Voltage-controlled oscillator with input and output on opposite corners of substrate |
5979048, |
Jun 21 1995 |
POLYPLASTICS, CO , INC ; SANKYOUKASEI CO , LTD |
Method of manufacturing connectors |
5991162, |
Jun 27 1997 |
Renesas Electronics Corporation |
High-frequency integrated circuit device and manufacture method thereof |
6046409, |
Feb 26 1997 |
NGK SPARK PLUG CO , LTD |
Multilayer microelectronic circuit |
6057597, |
Dec 15 1997 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Semiconductor package with pre-fabricated cover |
6058004, |
Sep 08 1997 |
KNOWLES CAPITAL FORMATION, INC |
Unitized discrete electronic component arrays |
6084780, |
Feb 06 1996 |
Kabushiki Kaisha Toshiba |
Printed circuit board with high electronic component density |
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Jun 08 1998 |
Visteon Global Technologies, Inc |
Enhanced mounting pads for printed circuit boards |
6144090, |
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Fujitsu Limited |
Ball grid array package having electrodes on peripheral side surfaces of a package board |
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Sep 14 1993 |
Kabushiki Kaisha Toshiba |
Multi-chip module having printed wiring board comprising circuit pattern for IC chip |
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MAGNACHIP SEMICONDUCTOR LTD |
Semiconductor package substrate and semiconductor package |
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Dyconex Patente AG |
Foil circuit boards and semifinished products and method for the manufacture thereof |
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Multi-chip semiconductor chip module |
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Mar 22 2000 |
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Agilent Technologies, Inc |
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Data Device Corporation |
Optocoupler package being hermetically sealed |
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MURATA MANUFACTURING CO , LTD |
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TDK Corporation |
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Kabushiki Kaisha Toshiba |
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Kabushiki Kaisha Toshiba |
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Murata Manufacturing Co., Ltd. |
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Murata Manufacturing Co., Ltd. |
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Samsung Electro-Mechanics Co., Ltd. |
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Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device |
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May 31 2007 |
Omron Corporation |
Socket |
D605613, |
May 15 2008 |
CommScope EMEA Limited; CommScope Technologies LLC |
Printed circuit board for electrical connector |
D616373, |
Jul 24 2007 |
Omron Corporation |
Connector for flexible printed circuit board |
D643040, |
Oct 26 2010 |
Hon Hai Precision Ind. Co., Ltd. |
Electrical card |