|
The ornamental design for a light emitting diode board, as shown and described.
|
|||||||||||||||||
FIG. 1 is a front side perspective view of a light emitting diode board in accordance with the first embodiment of the our new design;
FIG. 2 is a top plan view of the light emitting diode board in accordance with the first embodiment of our new design;
FIG. 3 is a bottom plan view of the light emitting diode board in accordance with the first embodiment of our new design;
FIG. 4 is a front elevational view of the light emitting diode board in accordance with the first embodiment of our new design;
FIG. 5 is a rear elevational view of the light emitting diode board in accordance with the first embodiment of our new design;
FIG. 6 is a right side elevational view of the light emitting diode board in accordance with the first embodiment of our new design;
FIG. 7 is a left side elevational view of the light emitting diode board in accordance with the first embodiment of our new design;
FIG. 8 is a front side perspective view of a light emitting diode board in accordance with the first embodiment of our new design;
FIG. 9 is a top plan view of the light emitting diode board in accordance with the first embodiment of our new design with a surrounding structure shown in broken lines;
FIG. 10 is a bottom plan view of the light emitting diode board in accordance with the first embodiment of our new design with a surrounding structure shown in broken lines;
FIG. 11 is a front elevational view of the light emitting diode board in accordance with the first embodiment of our new design with a surrounding structure shown in broken lines;
FIG. 12 is a rear elevational view of the light emitting diode board in accordance with the first embodiment of our new design with a surrounding structure shown in broken lines;
FIG. 13 is a right side elevational view of the light emitting diode board in accordance with the first embodiment of our new design with a surrounding structure shown in broken lines;
FIG. 14 is a left side elevational view of the light emitting diode board in accordance with the first embodiment of our new design with a surrounding structure shown in broken lines;
FIG. 15 is a front side perspective view of a light emitting diode board in accordance with the second embodiment of our new design;
FIG. 16 is a top plan view of the light emitting diode board in accordance with the second embodiment of our new design;
FiG. 17 is a bottom plan view of the light emitting diode board in accordance with the second embodiment of our new design;
FIG. 18 is a front elevational view of the light emitting diode board in accordance with the second embodiment of our new design;
FIG. 19 is a rear elevational view of the light emitting diode board in accordance with the second embodiment of our new design;
FIG. 20 is a right side elevational view of the light emitting diode board in accordance with the second embodiment of our new design; and,
FIG. 21 is a left side elevational view of the light emitting diode board in accordance with the second embodiment of our new design.
The broken lines and dotted lines showing the environment (the remaining structure of the light emitting diode board) in the Figures are provided for illustrative purposes only and form no part of the claimed design.
Muguruma, Shuji, Funamoto, Keiji
| Patent | Priority | Assignee | Title |
| D552559, | Aug 31 2005 | OSRAM SYLVANIA Inc | Electrical connector |
| D555598, | Aug 31 2005 | OSRAM SYLVANIA Inc | Electrical connector |
| D580375, | Oct 12 2006 | SEMI-PHOTONICS CO , LTD | Lead frame for a two-pin light emitting diode device |
| D580376, | Oct 12 2006 | SEMI-PHOTONICS CO , LTD | Lead frame for a four-pin light-emitting diode device |
| D582360, | Oct 12 2006 | SEMI-PHOTONICS CO , LTD | Lead frame for a through-hole light emitting diode device |
| D587395, | Apr 03 2008 | BARCO, INC | Back panel for a light emitting tile |
| D587396, | Apr 03 2008 | BARCO, INC | Back panel for a light emitting tile |
| D613702, | Oct 12 2006 | SEMILEDS OPTOELECTRONICS CO , LTD | Two-pin lead frame for a LED device |
| D634716, | Aug 06 2009 | Toshiba Lighting & Technology Corporation | Light emitting diode illumination device |
| D668658, | Nov 15 2011 | connectBlue AB | Module |
| D668659, | Nov 15 2011 | connectBlue AB | Module |
| D680119, | Nov 15 2011 | connectBlue AB | Module |
| D680545, | Nov 15 2011 | connectBlue AB | Module |
| D685751, | Mar 14 2012 | Walsin Lihwa Corporation | Substrate for light emitting diode |
| D689053, | Nov 15 2011 | connectBlue AB | Module |
| D692896, | Nov 15 2011 | connectBlue AB | Module |
| D694204, | Dec 03 2012 | Molex Incorporated | LED holder |
| D701181, | Dec 03 2012 | Molex Incorporated | LED holder |
| D705182, | Dec 03 2012 | Molex Incorporated | LED holder |
| D705183, | Dec 03 2012 | Molex Incorporated | LED holder |
| D737499, | Jul 13 2012 | Asahi Rubber Inc. | Lens for light-emitting diode |
| D770988, | Feb 06 2015 | SEOUL VIOSYS CO , LTD | Light emitting diode |
| D776629, | Feb 06 2015 | SEOUL VIOSYS CO , LTD | Light emitting diode |
| D989011, | Jan 26 2021 | Citizen Electronics Co., Ltd.; Citizen Watch Co., Ltd. | Light emitting diode |
| Patent | Priority | Assignee | Title |
| 6345902, | Nov 17 1998 | Ichikoh Industries, Ltd. | Light emitting diode mounting structure |
| 6383835, | Sep 01 1995 | Canon Kabushiki Kaisha | IC package having a conductive material at least partially filling a recess |
| 6422716, | Mar 16 2000 | BJB GMBH & CO KG | Modular led assembly |
| 6534799, | Oct 03 2000 | Harvatek Corp. | Surface mount light emitting diode package |
| D505120, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
| D508234, | Jan 21 2004 | Moriyama Sangyo Kabushiki Kaisha | LED holder |
| RE36614, | Jul 17 1998 | OSRAM OPTO SEMICONDUCTORS GMBH & CO OGH | Modular surface mount component for an electrical device or LED's |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 25 2005 | MUGURUMA, SHUJI | Nichia Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016631 | /0121 | |
| May 25 2005 | FUNAMOTO, KEIJI | Nichia Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016631 | /0121 | |
| May 31 2005 | Nichia Corporation | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |