| Patent |
Priority |
Assignee |
Title |
| 2706742, |
|
|
|
| 3185947, |
|
|
|
| 3398232, |
|
|
|
| 3747210, |
|
|
|
| 3760091, |
|
|
|
| 3964087, |
May 15 1975 |
Burroughs Corporation |
Resistor network for integrated circuit |
| 4029531, |
Mar 29 1976 |
RCA Corporation |
Method of forming grooves in the [011] crystalline direction |
| 4074340, |
Oct 18 1976 |
Vitramon, Incorporated |
Trimmable monolithic capacitors |
| 4223321, |
Apr 30 1979 |
EASTMAN KODAK COMPANY A NJ CORP |
Planar-faced electrode for ink jet printer and method of manufacture |
| 4288840, |
Sep 26 1978 |
Matsushita Electric Industrial Co., Ltd. |
Printed circuit board |
| 4312026, |
Apr 11 1979 |
TDK CORPORATION 13-1 NIHOMBASHI 1-CHOME, CHUO-KU, TOKYO |
Chip ceramic capacitor |
| 4313157, |
Sep 26 1978 |
Draloric Electronic GmbH |
Capacitive network |
| 4400762, |
Aug 25 1980 |
Allen-Bradley Company |
Edge termination for an electrical circuit device |
| 4419714, |
Apr 02 1982 |
International Business Machines Corporation |
Low inductance ceramic capacitor and method for its making |
| 4430690, |
Oct 07 1982 |
International Business Machines Corporation |
Low inductance MLC capacitor with metal impregnation and solder bar contact |
| 4437141, |
Sep 14 1981 |
Texas Instruments Incorporated |
High terminal count integrated circuit device package |
| 4522449, |
Dec 27 1977 |
|
Matrix board |
| 4616655, |
Jan 20 1984 |
Pacesetter, Inc |
Implantable pulse generator having a single printed circuit board and a chip carrier |
| 4627533, |
Oct 29 1984 |
Hughes Aircraft Company |
Ceramic package for compensated crystal oscillator |
| 4630171, |
Nov 22 1983 |
Interconnexions Ceramiques SA |
Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members |
| 4661884, |
Mar 10 1986 |
American Technical Ceramics Corp. |
Miniature, multiple layer, side mounting high frequency blocking capacitor |
| 4750246, |
Oct 29 1984 |
Hughes Aircraft Company |
Method of making compensated crystal oscillator |
| 4775917, |
Dec 03 1985 |
Wells Manufacturing Company |
Thermal compensated circuit board interconnect apparatus and method of forming the same |
| 4790894, |
Feb 19 1987 |
Howmet Research Corporation |
Process for producing printed wiring board |
| 4821007, |
Feb 06 1987 |
ANAREN MICROWAVE, INC |
Strip line circuit component and method of manufacture |
| 4842184, |
Jun 23 1988 |
Lockheed Martin Corp |
Method and apparatus for applying solder preforms |
| 4852227, |
Nov 25 1988 |
MRA Laboratories, Inc |
Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge |
| 4853826, |
Aug 01 1988 |
Circuit Components, Incorporated |
Low inductance decoupling capacitor |
| 4947286, |
Aug 11 1988 |
Murata Manufacturing Co., Ltd. |
Multilayer capacitor device |
| 4956694, |
Nov 04 1988 |
TWILIGHT TECHNOLOGY, INC |
Integrated circuit chip stacking |
| 4963843, |
Oct 31 1988 |
CTS Corporation |
Stripline filter with combline resonators |
| 4978639, |
Jan 10 1989 |
AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD |
Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips |
| 5092035, |
Sep 10 1990 |
Motorola, Inc |
Method of making printed circuit board assembly |
| 5140745, |
Jul 23 1990 |
|
Method for forming traces on side edges of printed circuit boards and devices formed thereby |
| 5206495, |
Oct 24 1989 |
CLM COMBICARD LICENSE MARKETING GMBH; CLM COMBICARD LICENSE MARKETING GMBH+CO KG |
Chip card |
| 5225969, |
Dec 15 1989 |
TDK Corporation |
Multilayer hybrid circuit |
| 5239198, |
Sep 06 1989 |
Freescale Semiconductor, Inc |
Overmolded semiconductor device having solder ball and edge lead connective structure |
| 5293067, |
May 23 1991 |
Freescale Semiconductor, Inc |
Integrated circuit chip carrier |
| 5309326, |
Dec 06 1991 |
Rohm Co., Ltd. |
Circuit module having stacked circuit boards |
| 5367430, |
Oct 21 1992 |
PRESIDIO COMPONENTS INC |
Monolithic multiple capacitor |
| 5376778, |
Feb 26 1992 |
Angewandte Digital Electronik GmbH |
Contact-free chip card for remote transmission |
| 5383095, |
Oct 29 1993 |
The Whitaker Corporation; WHITAKER CORPORATION, THE |
Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge |
| 5386087, |
Feb 17 1992 |
Berg Technology, Inc |
Printed circuit board having U-shaped solder mask layer separating respective contacts |
| 5428885, |
Jan 14 1989 |
TDK Corporation |
Method of making a multilayer hybrid circuit |
| 5471368, |
Nov 16 1993 |
International Business Machines Corporation |
Module having vertical peripheral edge connection |
| 5488765, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Method of measuring characteristics of a multilayer electronic component |
| 5493769, |
Aug 05 1993 |
Murata Manufacturing Co., Ltd. |
Method of manufacturing electronic component and measuring characteristics of same |
| 5514907, |
Mar 21 1995 |
Simple Technology Incorporated |
Apparatus for stacking semiconductor chips |
| 5599413, |
Nov 25 1992 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
Method of producing a ceramic electronic device |
| 5600101, |
Jul 21 1994 |
MURATA MANUFACTURING CO , LTD |
Multilayer electronic component and method of manufacturing the same |
| 5604328, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Multilayer electronic component |
| 5621619, |
Oct 25 1990 |
CTS Corporation |
All ceramic surface mount sip and dip networks having spacers and solder barriers |
| 5625935, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Method of manufacturing a multilayer electronic component |
| 5635669, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Multilayer electronic component |
| 5635670, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Multilayer electronic component |
| 5644107, |
Jul 27 1992 |
Murata Manufacturing Co., Ltd. |
Method of manufacturing a multilayer electronic component |
| 5661420, |
Mar 08 1995 |
TETRA LAVAL HOLDINGS & FINANCE S A ; ETYMOTIC RESEARCH, INC |
Mounting configuration for monolithic integrated circuit |
| 5714239, |
Mar 15 1993 |
Murata Manufacturing Co., Ltd. |
Composite component |
| 5729437, |
Jun 22 1994 |
Seiko Epson Corporation |
Electronic part including a thin body of molding resin |
| 5731709, |
Jan 26 1996 |
SHENZHEN XINGUODU TECHNOLOGY CO , LTD |
Method for testing a ball grid array semiconductor device and a device for such testing |
| 5740010, |
Oct 21 1992 |
|
Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors |
| 5752182, |
May 09 1994 |
Matsushita Electric Industrial Co., Ltd. |
Hybrid IC |
| 5773812, |
Feb 08 1994 |
Angewandte Digital Elektronik GmbH |
Chip card capable of both contact and contactless operation including a contact block |
| 5811799, |
Jul 31 1997 |
Harvatek Corporation |
Image sensor package having a wall with a sealed cover |
| 5841217, |
Mar 14 1996 |
CITIZEN HOLDINGS CO , LTD |
Surface mounting crystal unit |
| 5847930, |
Oct 13 1995 |
HEI, Inc. |
Edge terminals for electronic circuit modules |
| 5854534, |
Aug 05 1992 |
Fujitsu Limited |
Controlled impedence interposer substrate |
| 5877561, |
Dec 29 1995 |
MAGNACHIP SEMICONDUCTOR LTD |
Plate and column type semiconductor package having heat sink |
| 5917709, |
Jun 16 1997 |
Eastman Kodak Company |
Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
| 5949294, |
Sep 20 1996 |
JVC Kenwood Corporation |
Reference frequency source oscillator formed from first and second containers |
| 5966052, |
Apr 09 1997 |
Murata Manufacturing Co., Ltd. |
Voltage-controlled oscillator with input and output on opposite corners of substrate |
| 5979048, |
Jun 21 1995 |
POLYPLASTICS, CO , INC ; SANKYOUKASEI CO , LTD |
Method of manufacturing connectors |
| 5991162, |
Jun 27 1997 |
Renesas Electronics Corporation |
High-frequency integrated circuit device and manufacture method thereof |
| 6046409, |
Feb 26 1997 |
NGK SPARK PLUG CO , LTD |
Multilayer microelectronic circuit |
| 6057597, |
Dec 15 1997 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Semiconductor package with pre-fabricated cover |
| 6058004, |
Sep 08 1997 |
KNOWLES CAPITAL FORMATION, INC |
Unitized discrete electronic component arrays |
| 6084780, |
Feb 06 1996 |
Kabushiki Kaisha Toshiba |
Printed circuit board with high electronic component density |
| 6115262, |
Jun 08 1998 |
Visteon Global Technologies, Inc |
Enhanced mounting pads for printed circuit boards |
| 6144090, |
Feb 13 1997 |
Fujitsu Limited |
Ball grid array package having electrodes on peripheral side surfaces of a package board |
| 6147876, |
Sep 14 1993 |
Kabushiki Kaisha Toshiba |
Multi-chip module having printed wiring board comprising circuit pattern for IC chip |
| 6181560, |
Jul 28 1995 |
MAGNACHIP SEMICONDUCTOR LTD |
Semiconductor package substrate and semiconductor package |
| 6218628, |
May 18 1994 |
Dyconex Patente AG |
Foil circuit boards and semifinished products and method for the manufacture thereof |
| 6278178, |
Feb 10 1998 |
HYUNDAI ELECTRONICS INDUSTRIES CO , LTD |
Integrated device package and fabrication methods thereof |
| 6287949, |
Jun 20 1994 |
SOCIONEXT INC |
Multi-chip semiconductor chip module |
| 6288345, |
Mar 22 2000 |
OL SECURITY LIMITED LIABILITY COMPANY |
Compact z-axis DC and control signals routing substrate |
| 6378757, |
Jan 31 2001 |
Agilent Technologies, Inc |
Method for edge mounting flex media to a rigid PC board |
| 6383835, |
Sep 01 1995 |
Canon Kabushiki Kaisha |
IC package having a conductive material at least partially filling a recess |
| 6388264, |
Mar 28 1997 |
Data Device Corporation |
Optocoupler package being hermetically sealed |
| 6407904, |
May 10 1999 |
MURATA MANUFACTURING CO , LTD |
Multi-layer capacitor |
| 6407906, |
Dec 06 1999 |
TDK Corporation |
Multiterminal-multilayer ceramic capacitor |
| 6418030, |
Sep 14 1993 |
Kabushiki Kaisha Toshiba |
Multi-chip module |
| 6456168, |
Dec 29 2000 |
CTS CORPORATION, A CORP OF INDIANA |
Temperature compensated crystal oscillator assembled on crystal base |
| 6462408, |
Mar 27 2001 |
TAMIRAS PER PTE LTD , LLC |
Contact member stacking system and method |
| 6496355, |
Oct 04 2001 |
AVX Corporation |
Interdigitated capacitor with ball grid array (BGA) terminations |
| 6534726, |
Oct 25 1999 |
MURATA MANUFACTURING CO , LTD |
Module substrate and method of producing the same |
| 6566611, |
Sep 26 2001 |
Intel Corporation |
Anti-tombstoning structures and methods of manufacture |
| 6576999, |
Jul 06 2000 |
Murata Manufacturing Co., Ltd. |
Mounting structure for an electronic component having an external terminal electrode |
| 6583981, |
Nov 29 2000 |
Murata Manufacturing Co., Ltd. |
Ceramic condenser module |
| 6601295, |
Mar 03 1999 |
|
Method of producing chip-type electronic devices |
| 6601296, |
Jul 06 1999 |
THE BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT |
Multi-shot injection molding process for making electrical connectors and three-dimensional circuits |
| 6606237, |
Jun 27 2002 |
Murata Manufacturing Co., Ltd.; Intel Corporation |
Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same |
| 6624505, |
Feb 06 1998 |
Invensas Corporation |
Packaged integrated circuits and methods of producing thereof |
| 6639311, |
Oct 05 2001 |
Murata Manufacturing Co., Ltd. |
Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 6657848, |
Jan 28 2000 |
TDK Corporation |
Multilayer electronic device and method for producing same |
| 6665930, |
Mar 04 1998 |
Koninklijke Philips Electronics N V |
Printed circuit board with SMD components |
| 6670700, |
Aug 19 1999 |
Seiko Epson Corporation |
Interconnect substrate and semiconductor device electronic instrument |
| 6700794, |
Jul 26 2001 |
Harris Corporation |
Decoupling capacitor closely coupled with integrated circuit |
| 6713868, |
Nov 30 2001 |
Kabushiki Kaisha Toshiba |
Semiconductor device having leadless package structure |
| 6714420, |
May 30 2000 |
ALPS ELECTRIC CO , LTD |
Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 6724083, |
Jul 16 2001 |
ARS Electronics Co., Ltd. |
Method of producing semiconductor packages by cutting via holes into half when separating substrate |
| 6751101, |
Nov 02 2000 |
Murata Manufacturing Co., Ltd. |
Electronic component and method of producing the same |
| 6759940, |
Jan 10 2002 |
ACF FINCO I LP |
Temperature compensating device with integral sheet thermistors |
| 6760227, |
Nov 02 2000 |
Murata Manufacturing Co., Ltd.; MURATA MANUFACTURING CO , LTD |
Multilayer ceramic electronic component and manufacturing method thereof |
| 6795294, |
Jan 31 2003 |
Murata Manufacturing Co., Ltd. |
Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit |
| 6803251, |
Feb 10 1998 |
Hyundai Electronics Industries Co., Ltd. |
Integrated device package and fabrication methods thereof |
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Sep 30 2002 |
Macom Technology Solutions Holdings, Inc |
Packaged RF power transistor having RF bypassing/output matching network |
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Feb 08 2001 |
Micron Technology, Inc. |
High performance silicon contact for flip chip and a system using same |
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Jan 17 2001 |
Honeywell International, Inc. |
Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
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Apr 15 2003 |
Kemet Electronics Corporation |
Monolithic multi-layer capacitor with improved lead-out structure |
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Oct 18 2002 |
Continental Automotive Systems, Inc |
Feedthrough design and method for a hermetically sealed microdevice |
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Jul 06 2000 |
PHYCOMP HOLDING B V |
Ceramic multilayer capacitor array |
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Dec 27 2001 |
ALPS Electric Co., Ltd. |
Jumper chip component and mounting structure therefor |
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Apr 24 2002 |
Sanyo Electric Co., Ltd. |
Hybrid integrated circuit device |
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Apr 15 2002 |
KYOCERA AVX Components Corporation |
Plated terminations |
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Dec 17 2002 |
Seiko Epson Corporation |
Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator |
| 7041527, |
Jul 29 1997 |
Harvatek Corporation |
Charge coupled device package |
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Feb 03 1999 |
Rohm Co., Ltd. |
Semiconductor device and semiconductor chip for use therein |
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Mar 11 2004 |
TDK Corporation |
Laminated ceramic capacitor |
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Apr 15 2002 |
KYOCERA AVX Components Corporation |
Component formation via plating technology |
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Apr 16 2004 |
Kemet Electronics Corporation |
Thermal dissipating capacitor and electrical component comprising same |
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Sep 27 2001 |
HAMAMATSU PHOTONICS K K |
Semiconductor device and method of manufacturing the device |
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Dec 27 2001 |
ALPS Electric Co., Ltd. |
Jumper chip component and mounting structure therefor |
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Aug 26 2004 |
Nihon Dempa Kogyo Co., Ltd. |
Surface mount crystal oscillator |
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Feb 03 1999 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Semiconductor device and semiconductor chip for use therein |
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Apr 15 2002 |
KYOCERA AVX Components Corporation |
Method for forming plated terminations |
| 7168161, |
Aug 25 2003 |
Renesas Electronics Corporation |
Manufacturing method of solid-state image sensing device |
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Apr 15 2002 |
KYOCERA AVX Components Corporation |
Plated terminations |
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Apr 01 2002 |
INTERPLEX INDUSTRIES, INC |
Method of retaining a solder mass on an article |
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Dec 28 2004 |
Intel Corporation |
Capacitor design for controlling equivalent series resistance |
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Jun 18 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
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Nov 22 2005 |
Lih Duo International Co., Ltd. |
IC embedding seat |
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Sep 03 2003 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Method for manufacturing solid-state imaging devices |
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Apr 28 2003 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
Solid-state imaging device and method for producing the same |
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Jun 18 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Support elements for semiconductor devices with peripherally located bond pads |
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Apr 16 2004 |
Kemet Electronics Corporation |
Thermal dissipating capacitor and electrical component comprising same |
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Oct 06 2003 |
SEMICONDUCTOR ENERGY LABORATORY CO , LTD |
Semiconductor device and method for manufacturing the same |
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Jul 12 2006 |
TDK Corporation |
Multilayer capacitor array |
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Mar 10 2005 |
TDK Corporation |
Multilayer capacitor |
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Nov 22 2005 |
Murata Manufacturing Co., Ltd. |
Multilayer capacitor |
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Aug 06 2007 |
Samsung Electro-Mechanics Co., Ltd. |
Multilayer chip capacitor |
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Nov 14 2000 |
SHENZHEN XINGUODU TECHNOLOGY CO , LTD |
Low profile integrated module interconnects and method of fabrication |
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Nov 22 2005 |
Murata Manufacturing Co., Ltd. |
Multilayer capacitor |
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Mar 03 2008 |
UNIVERSAL SCIENTIFIC INDUSTRIAL SHANGHAI CO , LTD |
Wireless communication module |
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Apr 15 2002 |
KYOCERA AVX Components Corporation |
Plated terminations and method of forming using electrolytic plating |
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Nov 17 2005 |
Samsung Electro-Mechanics Co., Ltd. |
Multilayer chip capacitor |
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Sep 04 2003 |
University of Notre Dame du Lac |
Inter-chip communication |
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May 22 2006 |
Murata Manufacturing Co., Ltd. |
Monolithic ceramic capacitor |
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Jun 29 2006 |
Intel Corporation |
Conductive interconnects along the edge of a microelectronic device |
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Jan 23 2007 |
Samsung Electronics Co., Ltd. |
Chip having side pad, method of fabricating the same and package using the same |
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Jun 14 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Wafer level packaging |
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Nov 15 2007 |
Advanced Semiconductor Engineering, Inc. |
Low temperature co-fired ceramics substrate and semiconductor package |
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Nov 25 2003 |
ETA SA Manufacture Horlogere Suisse |
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Nov 30 2005 |
Nihon Dempa Kogyo Co., Ltd. |
Surface mount type crystal oscillator |
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Sep 04 2003 |
University of Notre Dame du Lac |
Inter-chip communication |
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May 06 2003 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Method for packaging circuits |
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U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Wafer level packaging |
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May 15 2008 |
CommScope EMEA Limited; CommScope Technologies LLC |
Circuit board for electrical connector and electrical connector |
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Oct 08 2001 |
Round Rock Research, LLC |
Apparatus and method for packaging circuits |
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Apr 01 2008 |
Samsung Electro-Mechanics Co., Ltd. |
Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network |
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Mar 10 1999 |
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Aug 23 2000 |
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Jun 30 2000 |
Molex Incorporated |
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Jun 30 2000 |
Molex Incorporated |
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Apr 27 2001 |
Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD |
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Apr 27 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit board |
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Jul 10 2001 |
Sony Corporation |
Information recording element |
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Mar 29 2002 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
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Nov 27 2002 |
LENOVO INTERNATIONAL LIMITED |
Server blade chassis midplane printed circuit board with cover |
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Aug 08 2003 |
Hon Hai Precision Ind. Co., Ltd. |
Electrical connector |
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Aug 19 2003 |
Japan Aviation Electronics Industry, Limited |
Electrical connector |
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Dec 05 2003 |
Nichia Corporation |
Light emitting diode |
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Feb 23 2004 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
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Kabushiki Kaisha Toshiba |
Semiconductor device |
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Nichia Corporation |
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Cheng Uei Precision Industry Co., Ltd. |
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May 31 2007 |
Omron Corporation |
Plug |
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Omron Corporation |
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CommScope EMEA Limited; CommScope Technologies LLC |
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Jul 24 2007 |
Omron Corporation |
Connector for flexible printed circuit board |
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Oct 26 2010 |
Hon Hai Precision Ind. Co., Ltd. |
Electrical card |